Silicon-Force provides end‑to‑end mm‑wave and sub‑THz IC design services, covering feasibility studies, specification, schematic capture, layout, verification, and post‑silicon validation using low‑node CMOS and BiCMOS processes. The service includes on‑chip antenna integration, automated calibration IP, and cloud‑based measurement analytics to deliver turnkey silicon solutions for automotive radar, industrial IoT, and medical imaging applications.
Funding
Funding not disclosed
Founders
Product
Problem
Designing high‑frequency integrated circuits for mm‑wave and sub‑THz applications requires deep expertise in RF, mixed‑signal, and analog design, as well as access to advanced silicon processes and verification infrastructure. Many OEMs and system integrators lack these capabilities, leading to prolonged development cycles, high NRE costs, and difficulty integrating on‑chip antennas for compact wireless solutions.
Solution
Silicon‑Force delivers a full‑stack IC design service that takes a concept from feasibility study through post‑silicon validation. The team conducts system‑level architecture definition, generates detailed specifications, and produces schematics, layout, and physical implementation using low‑node CMOS and BiCMOS processes. Integrated on‑chip antenna design reduces bill‑of‑materials and enables compact radar and high‑data‑rate transceiver modules. Automated calibration blocks and built‑in test structures accelerate silicon bring‑up, while a cloud‑based measurement suite provides performance verification against target metrics. Clients receive a turnkey silicon solution ready for volume production, shortening time‑to‑market and minimizing engineering overhead.
Target Audience
Primary customers are OEMs and system integrators developing automotive radar, autonomous‑driving sensors, industrial IoT transceivers, and medical imaging or monitoring devices that require compact, high‑frequency silicon solutions.
Features
- End‑to‑end design flow: feasibility, spec definition, schematic capture, layout, DRC/LVS, sign‑off, and post‑silicon validation
- Expertise in mm‑wave and sub‑THz blocks: LO synthesis (PLL, DLL, frequency multipliers), up/down‑conversion mixers, low‑noise and power amplifiers, variable‑gain stages, and high‑speed data converters
- On‑chip antenna design and integration using EM‑co‑simulation to meet size, bandwidth, and efficiency targets
- Automatic calibration IP for gain, frequency, LO leakage, IQ imbalance, and process variation compensation
- Support for both CMOS and BiCMOS process nodes, with access to multi‑project wafer (MPW) runs and full‑custom mask services
- Comprehensive verification using RF‑aware simulation (Spectre, ADS) and silicon‑measurements via automated test benches and cloud‑based analytics
- Design for manufacturability (DFM) guidelines, reliability analysis, and documentation packages for seamless hand‑off to foundries
- Optional IP licensing for reusable blocks (PLL cores, mixers, amplifiers) to accelerate future projects