Shobolinsky develops high‑performance hardware and software for image processing, data analysis, and computing in extreme, resource‑constrained environments on Earth and in space.
Funding
Funding not disclosed
Founders
Product
Problem
Robotic and exploration platforms operating in extreme, resource‑constrained environments—such as planetary rovers, high‑altitude drones, and compact field robots—require real‑time image processing and data analysis but lack rugged, high‑performance computing hardware that can survive harsh conditions and limited power budgets.
Solution
Shobolinsky designs and manufactures integrated hardware and software stacks that deliver high‑throughput image processing, AI inference, and scientific data analysis within tight power, size, and thermal envelopes. Their products combine custom‑engineered processors, FPGA‑based accelerators, and optimized firmware to execute AI models directly on the edge, eliminating reliance on external compute resources. By embedding AI only where it adds measurable value, the solutions enable autonomous navigation, on‑board scientific interpretation, and rapid decision‑making for both competition prototypes and upcoming ESA‑partnered missions. The modular architecture supports rapid prototyping and scaling from classroom robotics to space‑qualified exploration systems.
Target Audience
Primary customers are research institutions, aerospace contractors, and robotics teams developing autonomous platforms for space exploration, high‑altitude or underground missions, and competition‑level prototypes that require edge AI capabilities.
Features
- Rugged AI accelerator boards (e.g., Coral series) with radiation‑tolerant components for operation in vacuum and high‑radiation environments
- Low‑latency, on‑board image processing pipelines optimized for power‑limited platforms
- FPGA‑based data‑analysis modules that can be reprogrammed for mission‑specific algorithms
- Integrated software SDK providing AI model quantization, deployment tools, and real‑time telemetry APIs
- Thermal‑managed enclosure designs that meet space‑flight qualification standards
- Plug‑and‑play interfaces compatible with common rover and robot hardware (CAN, SPI, Ethernet)