Seminovaa
Seminovaa is a specialized semiconductor design services company focused exclusively on physical design and signoff engineering, taking chip designs from RTL through tapeout-ready GDSII. The company delivers floorplanning, timing closure with full STA signoff, power optimization, DRC/LVS/EM-IR verification, and pre-silicon DFT, with post-silicon test engineering support. Seminovaa has completed over 50 semiconductor design projects across mobile, communication, networking, and storage markets.
- Semiconductor
- Artificial Intelligence
- AI Agents
- Software Only
Funding
Founders
Founder details are not available yet.
Product
Problem
Semiconductor companies face increasing design complexity and time-to-market pressure, with traditional verification and physical implementation workflows often requiring multiple costly silicon iterations. First-pass silicon success remains challenging due to timing closure issues, verification gaps, and the difficulty of validating designs across PVT corners and high-speed interfaces.
Solution
Seminovaa provides specialized physical design and signoff engineering services covering the full implementation flow from RTL through tapeout-ready GDSII. The company focuses deeply on one discipline—physical design and signoff—delivering floorplanning, placement, clock tree synthesis, routing, and ECOs alongside full timing closure with STA signoff across corners. Their scope includes power optimization, pre-silicon DFT with scan insertion, ATPG and BIST planning, and complete signoff across DRC, LVS, and EM/IR. Post-silicon services cover silicon bring-up, characterization, and validation to support production readiness. The company deliberately stops at tapeout-ready GDSII, keeping manufacturing, packaging, and test with the customer or their foundry partner to maintain focus and accountability where chip teams need it most.
Target Audience
Primary customers are global semiconductor companies—including startups, mid-size product companies, and large enterprises—that need deep physical design and signoff expertise for ASIC/SoC implementations at advanced process nodes. The company has delivered over 50 semiconductor design projects across mobile, communication, networking, and storage markets.
Features
- RTL-to-GDSII implementation including floorplanning, placement, CTS, routing, and ECO with advanced-node expertise
- Full STA signoff across multiple corners and modes with timing closure engineering
- Pre-silicon DFT built into the flow: scan insertion, ATPG generation, and BIST planning for embedded test coverage
- Complete physical verification suite with DRC, LVS, and EM/IR signoff
- Power optimization techniques to meet performance and thermal targets at advanced process nodes
- Post-silicon test engineering supporting silicon bring-up, characterization, and validation from tapeout through production readiness