Semidrive provides automotive‑grade system‑on‑chips and high‑performance MCUs that integrate multi‑core Cortex‑A55 CPUs, lock‑step Cortex‑R5 safety cores, GPUs, AI accelerators, and a full suite of automotive interfaces. Built on 16 nm and 4 nm processes and qualified to ISO 26262 ASIL B/D and AEC‑Q100 Grade 2, the chips enable OEMs and Tier‑1 suppliers to consolidate infotainment, cockpit, gateway, ADAS, and industrial functions onto a single silicon die, reducing board complexity while meeting safety and security requirements.
Funding
$137.7M raised to dateRaised to date based on public sources. This may differ from the amount the company actually raised and is based only on what is publicly available on the internet.
Founders
Product
Problem
Automotive and industrial systems require high‑reliability, high‑performance compute platforms that meet automotive safety standards (ASIL, AEC‑Q100) while supporting advanced multimedia, AI, and connectivity functions. Traditional solutions often involve multiple discrete components, leading to higher cost, larger PCB area, and complex integration.
Solution
Semidrive delivers a family of automotive‑grade system‑on‑chips (SoCs) and high‑performance MCUs that integrate multi‑core Cortex‑A55 CPUs, lock‑step Cortex‑R5 safety cores, GPUs, AI accelerators, and a rich set of automotive interfaces (CAN‑FD, LIN, Ethernet TSN, USB, HDMI, video codecs). The chips are fabricated in 16 nm or 4 nm automotive processes, qualified to AEC‑Q100 Grade 2 and ISO 26262 ASIL B/D, and include built‑in hardware security modules (HSM) with support for national cryptographic algorithms. By providing pin‑to‑pin compatible product families (X9 for infotainment and cockpit, G9 for gateways and central compute, E3 for safety‑critical MCU functions), Semidrive enables OEMs to consolidate functionality onto a single silicon die, reduce board complexity, accelerate time‑to‑market, and meet functional‑safety and security requirements with a single vendor.
Target Audience
Primary customers are automotive OEMs and Tier‑1 suppliers developing next‑generation infotainment, cockpit, gateway, and ADAS systems, as well as robotics and industrial automation manufacturers that require automotive‑grade safety and security on a single chip.
Features
- Multi‑core Cortex‑A55 CPU clusters (up to 8 cores) combined with lock‑step Cortex‑R5 safety cores for deterministic real‑time processing
- Integrated GPU (up to 300 GFLOPS) and AI accelerator (up to 8 TOPS) for graphics, vision, and on‑device AI inference
- Comprehensive automotive I/O: CAN‑FD, LIN, Ethernet TSN, 1 GbE (multiple ports), USB 3.0, HDMI/DisplayPort, video encode/decode (H.264/H.265)
- Functional safety certification: ISO 26262 ASIL B (G9) and ASIL D (E3) with AEC‑Q100 Grade 2 reliability
- Built‑in hardware security module (HSM) supporting AES, RSA, ECC, SHA and Chinese SM2/3/4/9 algorithms
- Support for multiple operating systems and middleware (AUTOSAR, Linux, QNX) and over‑the‑air (OTA) firmware update with dual‑bank flash
- Scalable product matrix (X9E, X9M, X9H, X9S, X9HP, X9SP, G9X, G9Q, G9H, E31‑E36) with pin‑compatible variants for easy migration across performance tiers