Seichitech offers automated test and inspection systems for semiconductor memory, SoC, probe card, and micro‑display products, covering wafer‑level probing, burn‑in aging, and final‑product functional testing. Their hardware combines high‑precision optics, low‑contact MEMS probe cards, and AI‑driven analysis to deliver fast, accurate measurements that improve yield, reduce test time, and lower costs for high‑volume manufacturers.
Funding
Funding not disclosed
Founders
Product
Problem
Semiconductor manufacturers and display device producers need precise, high‑throughput testing and validation of memory chips, SoCs, probe cards, and micro‑display components, but existing equipment often lacks the accuracy, speed, and integrated automation required to ensure product reliability and yield at scale.
Solution
Seichitech provides a portfolio of automated test and inspection systems that cover the full lifecycle of semiconductor and display products—from wafer‑level probing and burn‑in aging to final‑product functional testing. Their solutions combine high‑precision optics, precision mechanics, advanced electronics, and proprietary software algorithms to deliver high‑speed, high‑accuracy measurements with low contact resistance and high parallelism. Integrated AI‑driven analysis and cloud‑enabled data handling enable real‑time defect detection, yield optimization, and streamlined workflow across R&D, pilot production, and mass manufacturing. By offering modular hardware platforms and customizable test software, Seichitech helps customers reduce test time, lower costs, and improve overall product reliability.
Target Audience
Primary customers are semiconductor memory and SoC manufacturers, display panel and micro‑display producers, and OEMs requiring high‑volume, high‑precision test and inspection equipment for R&D and mass production.
Features
- High‑density, low‑contact‑resistance MEMS probe cards for wafer‑level electrical testing with parallel test channels
- Fast, high‑precision DRAM and SoC testers supporting DDR4/5, LPDDR4/5, and advanced AI‑compute chips, featuring liquid‑cooling and wide temperature ranges
- Integrated burn‑in and aging modules for reliability verification of memory and display devices
- Automated optical inspection (AOI) and imaging systems for Micro‑LED/OLED wafer and module defect detection, including luminance and colorimetric analysis
- Real‑time AI algorithms for defect classification, yield analytics, and predictive maintenance
- Unified software platform with motion control, signal generation (FPGA‑based), and data management for end‑to‑end test automation
- Scalable architecture supporting both standalone operation and integration into existing production lines via standard interfaces