Simplenn manufactures the X2 Thruster, utilizing a unique 2D+ fabrication process that combines photochemical etching and diffusion bonding to create high-performance, scalable propulsion systems powered by zero-carbon hydrogen and oxygen propellants. This technology addresses the critical issue of limited propellant lifespan in satellites, enabling extended operational lifetimes and reducing thruster unit costs.
Funding
Funding not disclosed
Founders
Product
Problem
Satellites are increasingly limited by propellant lifespan, which restricts their operational lifetimes and necessitates costly replacements. The growing number of satellites in orbit increases the demand for efficient last-mile delivery and collision avoidance, further emphasizing the need for extended propellant capacity.
Solution
Simplenn addresses the limitations of satellite propellant lifespan with the X2 Thruster, a high-performance propulsion system powered by zero-carbon hydrogen and oxygen propellants. Utilizing a unique 2D+ fabrication process that combines photochemical etching and diffusion bonding, the X2 Thruster achieves scalable production and reduced unit costs. The thruster's design enables superior thermal management, resulting in attainable specific impulse ceilings 40-50% greater than industry-standard hydrazine alternatives. This extended propellant capacity unlocks years of additional operational lifetime and value for satellites.
Target Audience
The primary target audience includes satellite manufacturers and operators seeking to extend the operational life of their satellites and reduce thruster unit costs.
Features
- Employs water-electrolysis-derived hydrogen and oxygen as zero-carbon, non-toxic propellants.
- Achieves specific impulse ceilings 40-50% greater than hydrazine alternatives through advanced thermal management.
- Utilizes a 2D+ fabrication process combining photochemical etching and diffusion bonding.
- Photochemical etching performed on in-house lithography and jet-spray etching machines, enabling feature sizes below 25µm.
- Stacking and alignment process enables complex 3D structures with sheet alignment tolerances of 5µm.
- Diffusion bonding provides high-strength joining on similar and dissimilar materials, qualified for high-heat flux copper alloy.
- Scalable production enables large (100+ unit) batch sizes and capital-efficient development.