SAFI‑Tech provides a low‑heat reflow processing platform that allows standard high‑temperature solder alloys such as SAC305 to be reflowed up to 30 % below conventional temperatures. The system integrates with existing PCB assembly lines, delivering reduced thermal stress on flexible and high‑density boards, lower energy consumption, and higher throughput. It includes real‑time temperature monitoring and dynamic thermal zone control to improve yield and minimize defects.
Funding
$200K raised to dateRaised to date based on public sources. This may differ from the amount the company actually raised and is based only on what is publicly available on the internet.
Founders
Product
Problem
Standard reflow soldering processes require temperatures that exceed the thermal limits of flexible substrates and densely packed miniaturized components, leading to defects such as head‑in‑pillow and material degradation. The high thermal budget also drives elevated energy consumption and larger oven footprints, limiting manufacturing efficiency for advanced electronics.
Solution
SAFI‑Tech’s patented low‑heat processing platform enables industry‑standard high‑temperature alloys, including SAC305, to be reflowed at substantially reduced temperatures. By lowering the peak reflow temperature, the technology preserves the integrity of lightweight, flexible substrates and fine‑pitch components while maintaining required joint reliability. The reduced thermal exposure cuts energy usage and carbon emissions, and shortens oven dwell time, which increases line throughput and allows smaller reflow equipment. The platform integrates with existing solder‑paste application and pick‑and‑place workflows, delivering higher material yields and fewer temperature‑induced defects.
Target Audience
Primary customers are contract electronics manufacturers and OEMs that produce flexible, lightweight, or high‑density printed circuit assemblies requiring low‑thermal‑budget soldering processes.
Features
- Proprietary low‑temperature reflow methodology that processes SAC305 and comparable alloys at temperatures up to 30 % lower than conventional profiles
- Integrated thermal management controls that dynamically adjust heating zones to match component thermal budgets
- Compatibility with standard PCB manufacturing equipment, requiring only firmware or set‑point updates
- Real‑time monitoring of solder joint formation using embedded temperature sensors for process validation
- Energy‑efficiency gains of up to 25 % per reflow cycle, reducing operational costs and carbon footprint
- Reduced reflow cycle time, enabling higher production throughput and smaller oven footprint
- Yield improvement through mitigation of head‑in‑pillow and thermal degradation defects on flexible and high‑density boards