Reach Semiconductor provides a turnkey custom analog and mixed‑signal IP service for ASIC and SoC designers, delivering tape‑out‑ready blocks such as high‑fidelity audio DAC/ADC and low‑power front‑ends. The company handles the full design flow—from specification and architecture through RTL, layout, verification, and DfT insertion—across leading CMOS nodes, and supplies simulation models, documentation, and integration support.
Funding
Funding not disclosed
Founders
Product
Problem
Designing high-performance analog and mixed-signal blocks for audio and ultra‑low‑power applications requires deep semiconductor expertise and a full design flow from specification to tape‑out. Many ASIC and SoC teams lack in‑house resources to create custom IP, leading to extended development cycles and sub‑optimal performance. The scarcity of proven, application‑specific analog IP increases risk and cost for next‑generation electronic products.
Solution
Reach Semiconductor offers a turnkey custom analog and mixed‑signal IP service that covers the entire development lifecycle. Clients provide system requirements, and Reach’s engineering team defines architecture, creates RTL, performs layout and verification, and delivers a tape‑out‑ready IP block. The portfolio emphasizes advanced audio processing and low‑power front‑end designs, enabling customers to meet stringent performance and power budgets. Integrated design services include process‑node selection, design‑for‑test insertion, and post‑tape‑out support to accelerate time‑to‑market. Delivered IP is supplied with comprehensive documentation, test benches, and optional integration assistance for seamless inclusion into larger SoCs.
Target Audience
Primary customers are ASIC and SoC design teams at consumer electronics OEMs, audio equipment manufacturers, and IoT device developers who require high‑performance, low‑power analog or mixed‑signal IP for integration into their silicon products.
Features
- Custom analog IP blocks (e.g., high‑fidelity audio DAC/ADC, programmable gain amplifiers) optimized for signal‑to‑noise ratio and linearity
- Mixed‑signal IP cores with integrated digital control, clocking, and calibration logic for low‑power operation
- Full design flow services: system specification, architectural trade‑offs, RTL coding, schematic capture, layout, sign‑off verification, and tape‑out delivery
- Support for leading CMOS process nodes (28 nm, 65 nm, 130 nm) with foundry‑specific design rules and libraries
- Design‑for‑test (DfT) insertion and built‑in self‑test (BIST) structures to improve manufacturability and yield
- Detailed IP documentation, simulation models (Spectre, Verilog‑AMS), and reference software drivers for rapid integration
- Post‑tape‑out debug assistance and optional IP customization for future product revisions