R&D Altanova provides end-to-end test interface solutions for semiconductor automated test equipment (ATE). They design, simulate, and fabricate probe cards, load boards, and multi-layer organic (MLO) substrates to enable testing of advanced ICs at fine wafer nodes and complex package configurations.
Funding
Funding not disclosed
Founders
Product
Problem
Testing advanced semiconductor integrated circuits (ICs) at fine wafer nodes and complex package configurations presents significant challenges for traditional test interface solutions. Achieving high-yield characterization and validation requires specialized hardware capable of handling intricate geometries and signal integrity requirements.
Solution
R&D Altanova delivers comprehensive test interface solutions for automated test equipment (ATE) applications, encompassing both wafer sort and final test stages. The company provides end-to-end services, from initial design and signal/power integrity (SI/PI) simulation through advanced fabrication of probe cards, load boards, and multi-layer organic (MLO) substrates. Their proprietary technologies and processes are engineered to facilitate the testing of leading-edge semiconductor technologies, enabling customers to achieve faster time-to-market. R&D Altanova's global infrastructure and advanced fabrication capabilities ensure efficient delivery of these critical components.
Target Audience
Primary customers include integrated device manufacturers (IDMs), fabless semiconductor companies, and semiconductor foundries requiring advanced test interface solutions for their IC development and production.
Features
- Full turn-key test interface solutions for wafer sort and final test applications.
- In-house design and simulation capabilities for signal integrity (SI) and power integrity (PI).
- Advanced fabrication of probe cards with coplanarity specifications as low as 12 μm.
- Fine pitch load board fabrication down to 0.2mm.
- Fabrication of multi-layer organic (MLO) substrates.
- Manufacturing of burn-in boards.
- Embedded component solutions for printed circuit boards and daughter-cards.
- Proprietary technologies and processes for testing fine wafer nodes and complex ICs.
- Global infrastructure and advanced fabrication facilities for industry-leading cycle times.