RAAAM Technologies offers GCRAM, a high‑density embedded memory that serves as a drop‑in replacement for SRAM in semiconductor chips. The technology delivers up to 50% silicon area reduction and up to 10× lower power consumption while remaining compatible with standard CMOS processes. It enables higher on‑chip memory capacity for AI, ML, AR/VR, automotive, 5G, and data‑center applications.
Funding
$3M raised to dateRaised to date based on public sources. This may differ from the amount the company actually raised and is based only on what is publicly available on the internet.
EAFounders
Product
Problem
Modern chips used in AI, ML, AR/VR, automotive, 5G, and data centers require increasing amounts of on-chip SRAM, often accounting for over 50% of the chip size. Traditional SRAM scaling has reached its limits in advanced CMOS process nodes, leading to constrained memory capacities and higher fabrication costs.
Solution
RAAAM develops GCRAM, a high-density on-chip memory technology that serves as a cost-effective, drop-in replacement for SRAM. GCRAM is fully compatible with standard CMOS fabrication processes, requiring no additional process steps or costs. The patented technology extends Moore’s Law for on-chip memories, enabling semiconductor companies to enhance memory capacity and efficiency. GCRAM provides up to 50% silicon area reduction and up to 10x reduced power consumption compared to traditional SRAM.
Target Audience
The primary customers are semiconductor companies that require high-density, low-power on-chip memory solutions for applications such as AI, ML, automotive, 5G, and high-performance computing.
Features
- Up to 50% area reduction compared to SRAM
- Up to 10x power reduction compared to SRAM
- Fully compatible with standard CMOS fabrication processes
- Drop-in replacement for SRAM
- Patented technology extending Moore's Law for on-chip memories