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Qualinx

Qualinx develops ultra-low power Digital-RF technology for GNSS and IoT applications, offering the world's smallest GNSS sensor with up to ten times less energy consumption than existing solutions. This technology enables efficient tracking and connectivity for a wide range of assets, minimizing environmental impact through reduced energy use and emissions during production.

Delft, South HollandFounded 2015625K+ followers
Updated 2 months ago

Funding

$41.6M raised to dateRaised to date based on public sources. This may differ from the amount the company actually raised and is based only on what is publicly available on the internet.

Funding rounds are not available yet.

Founders

Product

Problem

GNSS receivers for IoT and edge devices typically consume tens of milliwatts, require large form‑factor chips, and offer limited flexibility in constellation or band selection, which shortens battery life and increases design complexity for manufacturers of connected products.

Solution

Qualinx delivers ultra‑low‑power, reconfigurable GNSS chips based on its patented Digital RF (DRF) technology. The DRF front‑end provides high linearity and low noise in a single‑chip, CMOS‑scalable design that can be tuned to the customer’s power budget and required constellations. Power consumption is reduced to 1 mW‑5 mW, while the chip footprint shrinks to under 8 mm², enabling longer battery life and smaller devices. The platform supports multi‑constellation, multi‑band operation and can be programmed for positioning, tracking, or timing use cases. Integrated advanced filtering and sensor‑fusion capabilities further improve accuracy without additional hardware.

Target Audience

Primary customers are OEMs and system integrators developing battery‑powered IoT, wearables, drones, robotics, and industrial tracking devices that require precise GNSS positioning, tracking, or timing.

Features

  • Patented Digital RF (DRF) front‑end with 100 % reconfigurability
  • Ultra‑low power consumption (1–5 mW) versus legacy 20 mW solutions
  • Single‑chip, CMOS‑scalable design with < 8 mm² footprint
  • Multi‑constellation and multi‑band support (triple‑band programmable)
  • Integrated advanced position filtering and smart sensor‑fusion
  • High linearity and low noise for improved signal quality
  • Reduced BOM cost and PCB area through fully integrated analog front‑end and baseband
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