Steve Allen
Vice President, Power
pSemi
pSemi designs and manufactures intelligent RF and power management semiconductor solutions using proprietary UltraCMOS® technology. Their high-performance components enable greater efficiency and miniaturization for connected devices across mobile, IoT, automotive, and communication infrastructure markets.
Updated 7 months ago
Funding
Raised to date
$17.6MRaised to date based on public sources. This may differ from the amount the company actually raised and is based only on what is publicly available on the internet.
Funding rounds are not available yet.
Founders
Gregory Szczeszynski
Sr. Director of Architecture and IC Development
Product
Problem
The increasing complexity and data demands of modern wireless communication systems, including 5G and IoT, require advanced semiconductor solutions. Traditional components often struggle to meet the performance, integration, and efficiency requirements for these evolving applications.
Solution
pSemi designs and manufactures intelligent RF and power management semiconductor solutions that address the challenges of connected devices. Leveraging proprietary RF-SOI technology, the company delivers high-performance components that enable greater efficiency and miniaturization. These solutions are integrated into a wide range of applications, from mobile devices and consumer electronics to communication infrastructure and automotive systems. By focusing on innovation in semiconductor technology, pSemi aims to provide the foundational components for the next generation of connected technologies.
Target Audience
pSemi targets manufacturers and developers in the mobile, consumer, communication infrastructure, IoT, automotive, and test & measurement markets who require high-performance RF and power management semiconductor components.
Features
- Proprietary UltraCMOS® technology platform, an advanced form of Silicon-on-Insulator (SOI), for superior RF and microwave performance.
- UltraCMOS+™ technology offering linearity approaching mechanical relays, power handling comparable to GaN, and low noise figures similar to GaAs.
- RF switches designed for high isolation, high linearity, and low insertion loss, supporting frequencies up to 67 GHz for mmWave applications.
- Digital Step Attenuators (DSAs) with high linearity and fast switching times, suitable for applications up to 55 GHz.
- Front-End Modules (FEMs) for Wi-Fi and IoT devices, providing noise figure and size advantages.
- Power management solutions including charge pump capacitor dividers, 2-stage buck and boost regulators, and multi-level converters for high efficiency and reduced footprint.
- Products designed to meet stringent automotive quality standards, including AEC-Q100 Grade 2 compliance for RF switches.
- Integrated solutions that simplify system design and reduce overall component count and cost.