Precision Circuit Technologies provides ultra‑high‑density interconnect (UHDI) circuits using liquid crystal polymer substrates and particle‑free metal inks through additive and semi‑additive manufacturing. Their process achieves trace/space geometries down to 6 µm with 1 µm tolerance, low‑loss dielectric performance up to 110 GHz, and multilayer stacks of up to 30 layers, supporting high‑pin‑count sockets and chip embedding for compact, high‑speed electronic systems.
Funding
Funding not disclosed
Founders
Product
Problem
Conventional PCB fabrication processes struggle to meet the dimensional tolerances, impedance control, and low-loss requirements of modern high‑frequency, mmWave, and miniaturized electronic systems. Standard materials and etching methods limit trace/space geometries to >10 µm, impose high dielectric loss, and restrict multilayer stacking, resulting in larger form factors and degraded signal integrity.
Solution
Precision Circuit Technologies delivers ultra‑high‑density interconnect (UHDI) circuits by combining liquid crystal polymer (LCP) substrates with proprietary particle‑free metal inks and patented additive and semi‑additive manufacturing processes. The platform produces trace/space geometries as fine as 6 µm with 1 µm geometric tolerance, enabling precise impedance tuning within 1 Ω. Multi‑layer stacks of up to 30 layers are built with ultra‑low loss (Df ≈ 0.0017, Dk ≈ 2.9) suitable for frequencies up to 110 GHz and data rates of 224 Gb/s. Integrated capabilities such as die embedding, high‑pin‑count (up to 1,000 pins per 0.5 in²) sockets, and rapid 3‑D printed prototypes further reduce board size, improve signal integrity, and accelerate time‑to‑market.
Features
- Semi‑additive process (SAP) with laser‑ablated LCP vias and 1 µm trace tolerance for tight impedance control.
- Fully additive 3‑D printing using particle‑free Cu, Ag, Au, Pd, Pt inks, eliminating UV curing and preserving low loss.
- LCP dielectric substrate offering Dk = 2.9, Df = 0.0017 at 10 GHz, high thermal stability (≤260 °C) and moisture resistance (0.04 % absorption).
- Ultra‑thin multilayer stacks (≤30 layers) with straight‑sidewall traces and embedded passive/active components.
- High‑density pluggable sockets and connectors supporting up to 1,000 pins in a half‑square‑inch footprint for high‑speed I/O.
- Chip‑embedding capability that eliminates wire‑bond or BGA interconnects, improving electrical performance and mechanical reliability.
- Quick‑turn prototype turnaround (hours) via additive printing, enabling design validation without full‑scale tooling.
- Environmentally friendly, zero‑discharge manufacturing with up to 90 % waste reduction compared to conventional plating.