Tongtong Zhu
CEO and Founder
Porotech
The startup develops gallium nitride (GaN) material technology to create energy-efficient wide-bandgap semiconductors for the electronics industry. This technology enhances the performance and efficiency of light-emitting diodes and other electronic devices, addressing the need for improved energy consumption in modern electronics.
- Hardware
- Semiconductor
Updated 21 months ago
Funding
Raised to date
$26.1MRaised to date based on public sources. This may differ from the amount the company actually raised and is based only on what is publicly available on the internet.
Funding rounds are not available yet.
Founders
Product
Problem
Conventional LED manufacturing for microdisplays requires different materials for red, green, and blue subpixels, leading to complex manufacturing processes and increased costs. The performance of red LEDs made from AlGaInP materials degrades at high temperatures, causing color shifts and limiting display quality.
Solution
Porotech develops gallium nitride (GaN) based microLED technology that enables consistent material usage for red, green, and blue subpixels, simplifying manufacturing and improving display performance. Their PoroGaN® technology allows for the creation of InGaN-based red microLEDs, which offer improved thermal stability compared to traditional AlGaInP red LEDs. The company's Dynamic Pixel Tuning (DPT®) technology enables individual color control on a single LED chip, reducing the number of LEDs needed and increasing pixel density for higher resolution displays.
Target Audience
The primary target audience includes manufacturers of microdisplays for applications such as AR/VR headsets, smartwatches, automotive displays, and large-area displays.
Features
- PoroGaN® technology enables the creation of InGaN-based red microLEDs, eliminating the need for AlGaInP materials.
- DPT® technology allows for dynamic color control on a single LED chip, enabling a wider color gamut.
- Compatibility with standard semiconductor manufacturing processes and wafer-to-wafer bonding techniques.
- Capability to manufacture wafers in large sizes (8-12 inches) using sapphire and silicon materials.
- Microdisplays with smaller form factors suitable for wearable devices.
- High brightness and stability, ensuring visibility in high-contrast environments.
- Customizable epitaxy services for specific MicroLED applications.