Polariton Technologies manufactures the fastest electro-optic modulators using plasmonic structures integrated into photonic circuits, enabling high-speed data transmission for next-generation transceivers. Their technology addresses the demand for increased bandwidth in telecommunications, achieving speeds of up to 3.2 terabits per second.
Funding
$5M raised to dateRaised to date based on public sources. This may differ from the amount the company actually raised and is based only on what is publicly available on the internet.
Founders
Product
Problem
The increasing demand for bandwidth in telecommunications and data centers requires faster and more energy-efficient electro-optic modulators. Existing technologies struggle to achieve the required speeds and densities for next-generation transceivers, limiting the performance of high-speed data transmission.
Solution
Polariton Technologies provides photonic integrated circuits (PICs) based on silicon photonics and plasmonics for high-speed data transmission. Their electro-optic modulators offer enhanced speed, reduced size, and improved energy efficiency compared to conventional solutions. By integrating plasmonic structures into photonic circuits, Polariton's technology enables data transmission at speeds up to 3.2 terabits per second. These modulators support applications in communications, test and measurement, and quantum technologies, offering tailored options for both packaged and unpackaged solutions.
Target Audience
Polariton's primary customers include leaders in academia and industry involved in telecommunications, data centers, wireless communication, test and measurement, and quantum computing.
Features
- Electro-optic modulators with bandwidths up to 145 GHz
- Integration of plasmonics with silicon photonics for enhanced performance
- Support for O-band (1310 nm) and C-band (1550 nm) wavelengths
- Custom PIC design services with fast cycle times (4-6 months)
- Mach-Zehnder, ring modulator, and IQ modulator architectures
- High building block density for increased circuit integration
- Capability for both single-channel and multi-channel chip configurations
- Options for packaged (module) or unpackaged solutions