Pixel-Flo provides a fluidic self‑assembly process called Continuous‑Flo™ for mass transferring microLED die onto display substrates. By adapting a slot‑die coating method, the technology uses meniscus forces to guide millions of LEDs into photolithographically defined traps with micron‑level accuracy, eliminating waste and reducing steps, and works with any backplane for single‑step RGB assembly. This approach aims to lower material costs and improve throughput and yield for large‑scale microLED displays.
Funding
£5.3M raised to dateRaised to date based on public sources. This may differ from the amount the company actually raised and is based only on what is publicly available on the internet.
HPNFounders
Product
Problem
Current microLED display manufacturing relies on mechanical pick‑and‑place assembly, which cannot reliably place millions of LED die with micron‑level accuracy at high yield and low cost. The process incurs high material waste, limited scalability, and low throughput, preventing microLEDs from reaching mass‑market price points.
Solution
Pixel‑Flo addresses these limitations with Continuous‑Flo™, a fluidic self‑assembly process that replaces mechanical transfer. Known‑good LED die are released into an ink and guided by meniscus forces in a slot‑die coating system to photolithographically defined traps on the substrate. This method achieves micron‑level placement accuracy in a single step, is compatible with any backplane, and supports simultaneous RGB assembly. Because the slot‑die process scales with substrate size, unit costs decrease as displays grow larger, and smaller die can be utilized, further reducing material expenses. The streamlined three‑step workflow improves throughput and yield, making microLED production viable for high‑volume applications.
Target Audience
Primary customers are display manufacturers and OEMs developing large‑area microLED panels for televisions, automotive heads‑up displays, AR/VR headsets, and other consumer electronics seeking high‑performance, low‑cost solutions.
Features
- Ink‑based release of defect‑free LED die eliminates loss from mismatched carrier geometries
- Photolithographic trap patterning provides micron‑scale placement precision using existing array‑line equipment
- Adapted slot‑die coating creates a continuous meniscus that rapidly guides die into traps with high interaction rates
- Backplane‑agnostic process supports single‑step assembly of RGB LEDs, reducing the number of manufacturing steps
- Scalability of slot‑die technology lowers unit cost as substrate size increases, enabling cost‑effective large‑area displays
- Capability to handle smaller LED die than mechanical systems, decreasing material waste and overall component cost