PiCool Technologies provides a fiber‑based evaporative cooling platform that dissipates heat fluxes exceeding 500 W/cm² using a lightweight silica‑fiber matrix and low‑power centrifugal pump. The modular panels plug into standard 19‑inch racks and existing coolant loops, delivering AI‑driven flow control, real‑time telemetry, and energy‑efficient thermal management for hyperscale data‑center, high‑performance computing, AI accelerator and telecom hardware.
Funding
Funding not disclosed
Founders
Product
Problem
Next‑generation processors, GPUs, and high‑density telecom modules generate heat fluxes exceeding 500 W/cm², outpacing the capacity of conventional air‑ or liquid‑cooling systems. Excess thermal load forces over‑provisioned chillers, raises energy costs, and limits scaling of data‑center, AI, and aerospace hardware.
Solution
PiCool Technologies delivers a fiber‑based evaporative cooling platform that removes heat through rapid phase‑change within a lightweight, high‑surface‑area matrix. The system achieves heat‑flux removal >500 W/cm² while consuming minimal pump power, enabling compact, energy‑efficient thermal management for dense electronic racks. Its modular panels plug into standard rack mounts and integrate with existing coolant distribution networks, reducing retro‑fit complexity. Real‑time temperature sensing and closed‑loop control software optimize fluid flow and maintain uniform chip‑level temperatures, extending component lifetimes and supporting higher performance envelopes. The solution is engineered for scalability from single‑server units to hyperscale data‑center deployments.
Target Audience
Primary customers are hyperscale data‑center operators, high‑performance computing system integrators, AI accelerator manufacturers, and telecom equipment vendors requiring compact, high‑flux thermal solutions for dense electronic modules. Additional markets include aerospace and defense electronics where weight and reliability are critical.
Features
- Proprietary silica‑fiber evaporative matrix delivering >500 W/cm² heat‑flux dissipation via low‑energy vaporization
- Modular panel architecture compatible with 19‑inch rack standards and existing coolant loops
- Integrated high‑resolution thermistor array and AI‑driven control algorithm for adaptive flow regulation
- Low‑power centrifugal pump design achieving >90 % energy efficiency compared to conventional chillers
- Corrosion‑resistant, lightweight composite housing suitable for aerospace and defense environments
- API‑enabled telemetry for data‑center monitoring platforms and automated fault detection
- Scalable manufacturing process allowing rapid capacity expansion for hyperscale customers