Photoneo provides high‑resolution 3D vision sensors that generate dense point‑cloud data at up to 10 M points per second with sub‑millimeter accuracy. The sensors and accompanying SDKs deliver real‑time pose estimation, segmentation and motion‑planning APIs that integrate via ROS and industrial protocols for autonomous bin picking, depalletization and sorting. Optional cloud analytics add quality inspection and statistical process monitoring.
Funding
$23.7M raised to dateRaised to date based on public sources. This may differ from the amount the company actually raised and is based only on what is publicly available on the internet.
Founders
Product
Problem
Manufacturers and logistics operators often rely on manual handling or legacy 2‑D vision systems that cannot reliably detect object geometry in cluttered environments. This limits automation of tasks such as bin picking, depalletization, and piece picking, reducing throughput and increasing labor costs.
Solution
Photoneo delivers high‑precision 3D machine‑vision sensors combined with robotic intelligence software that generate dense point‑cloud data in real time. The sensors capture full‑field depth information without requiring structured lighting, enabling reliable detection of object shape and pose even in unstructured bins. Integrated SDKs and APIs provide ready‑to‑use algorithms for object segmentation, pose estimation, and motion planning, allowing robots to grasp and sort items autonomously. The platform supports standard industrial communication protocols and ROS, facilitating seamless integration with existing robot controllers and automation lines. Scalable hardware families—from compact units for tight workcells to large‑area scanners for pallet handling—address a wide range of factory and warehouse footprints. Cloud‑based analytics optionally enrich the data stream with quality inspection and statistical process control, further improving operational efficiency.
Target Audience
Primary customers are manufacturers, system integrators, and robotics OEMs seeking to automate pick‑and‑place, depalletization, and sorting operations in factories and warehouses.
Features
- High‑resolution 3D sensor (up to 10 M points / s) delivering dense point clouds with sub‑millimeter accuracy
- Real‑time depth processing pipeline (< 30 ms latency) for on‑the‑fly pose estimation and grasp planning
- Cross‑platform SDKs (C++, C#, Python) and ROS integration for rapid application development
- Built‑in auto‑calibration, adaptive exposure, and ambient‑light compensation for robust operation in varied lighting conditions
- Scalable hardware portfolio (compact units, PhoXi XL large‑area scanner, Alpha L) to match different workspace sizes
- Standard industrial interfaces (Ethernet/IP, OPC UA, TCP/IP) and compatibility with major robot manufacturers (e.g., ABB) for plug‑and‑play deployment
- Optional cloud analytics module for quality inspection, defect detection, and statistical process monitoring