Photon Bridge
Photon Bridge provides a modular photonic integration platform that combines and multiplexes light from multiple lower-power semiconductor lasers to deliver the optical power and wavelength density required by AI datacenter interconnects. The cantilever platform achieves sub-200 nm alignment accuracy during high-speed flip-chip bonding, enabling unlimited optical I/Os per device and support for any III-V material system. The company's manufacturing-first architecture is designed for high-volume production across multiple indium phosphide foundries.
- Semiconductor
- Hardware
Funding
Raised to date
€14.8MRaised to date based on public sources. This may differ from the amount the company actually raised and is based only on what is publicly available on the internet.
Est. $16.1Macross 2 rounds
AABDBO+1€10M · Seed
Announced Oct 2026
Disclosed cumulative: $16.1M
Founders
Founder details are not available yet.
Product
Problem
AI datacenter bandwidth is doubling every two years, pushing networks beyond the limits of electrical interconnects and driving the industry toward optical solutions. As optical connections move closer to AI chips through co-packaged optics, the demand for lasers is expected to reach millions of units annually—far exceeding the capacity of a supply chain built for telecom and subsea volumes.
Solution
Photon Bridge provides a modular photonic integration platform that combines and multiplexes light from multiple lower-power semiconductor lasers to deliver the optical power and wavelength density required by large AI systems. By separating active and passive photonic components rather than relying on complex monolithic integration, the company makes high-performance laser integration significantly easier to manufacture at scale. The cantilever platform delivers sub-200 nm alignment accuracy during high-speed flip-chip bonding, enabling unlimited optical I/Os per device and support for any III-V material system. With 25× lower wavelength variation, passive devices operate with little to no active tuning, reducing power, complexity, and cost. This manufacturing-first architecture is designed to enable high-volume production across multiple indium phosphide foundries.
Target Audience
Primary customers are AI datacenter operators, hyperscalers, and optical transceiver manufacturers adopting co-packaged optics and external laser sources, as well as LIDAR and spectral sensing companies needing high-power laser integration with low-cost manufacturing.
Features
- Combines and multiplexes light from multiple lower-power semiconductor lasers to deliver high optical power without increasing individual laser power density
- Cantilever platform achieves <200 nm alignment accuracy at optical I/Os during high-speed (>2 µm) flip-chip bonding, enabling unlimited I/Os per device
- 25× lower wavelength variation allowing passive devices to operate with little to no active tuning
- 50× larger silicon waveguide enabling >1W power handling capability
- 100× faster bonding compared to conventional photonic integration approaches
- Supports any III-V material system and production across multiple InP foundries for supply-chain flexibility
- Delivers up to 40 mW of optical power per wavelength per fiber with high wavelength counts