The startup manufactures and integrates microcrystalline diamonds to enhance thermal management in power delivery and high power communication systems. This technology mitigates overheating in semiconductor and electronic systems, improving performance for industries such as transportation, communication, lighting, and renewable energy manufacturing.
Funding
$8M raised to dateRaised to date based on public sources. This may differ from the amount the company actually raised and is based only on what is publicly available on the internet.
IIFounders
Product
Problem
Modern semiconductor and electronic systems face challenges related to overheating due to increasing power densities and leakage currents. Inadequate thermal management limits device performance, reduces reliability, and increases energy consumption. Existing heat dissipation methods often fail to keep pace with the demands of advanced technologies.
Solution
Phononics provides thermal management solutions by integrating microcrystalline diamond into semiconductor and electronic systems. Diamond's high thermal conductivity, over five times that of metal, enables efficient heat dissipation, resulting in lower operating temperatures and higher power densities. By embedding diamond heat spreaders close to heat sources, Phononics' technology reduces hotspots, improves device performance, and enhances reliability. This approach allows for sustained high frequencies and can lead to reduced cooling costs in applications such as data centers.
Target Audience
Phononics' primary customers include semiconductor manufacturers, electronic system designers, and companies in industries such as transportation, communication, lighting, and renewable energy seeking improved thermal management solutions.
Features
- Integration of microcrystalline diamond heat spreaders into chip packages
- Diamond layers with over fivefold the heat conductivity of metal
- Reduction of junction temperature by 10-20°C in joint experiments with Intel
- Performance improvement of up to 10% across various metrics
- Compatibility with current advanced packaging tools
- Three-dimensional heat dispersion, reducing hotspots and transferring heat outward
- Stable thermal bonding method for diamond integration