Skip to main content
O

Otowahr

Otowahr provides a monolithic planar‑magnetic MEMS micro‑speaker that integrates a silicon diaphragm, planar voice coil, and micro‑magnet in a single semiconductor process. The design delivers a flat 200 Hz‑5 kHz response with low distortion and low power consumption, enabling ultra‑compact TWS earbuds and hearing‑aid modules without sacrificing audio fidelity. It is compatible with standard audio ASIC interfaces for OEM integration.

Updated 2 months ago

Funding

Funding not disclosed

Funding rounds are not available yet.

Founders

Founder details are not available yet.

Product

Problem

Conventional microspeakers for in‑ear devices rely on dynamic or balanced‑armature drivers that require complex mechanical assembly, limiting miniaturization, acoustic consistency, and high‑volume manufacturability for true wireless stereo (TWS) earbuds and modern hearing aids. This creates a trade‑off between device size and sound quality, especially in the critical mid‑range frequencies for speech intelligibility and music fidelity.

Solution

Otowahr delivers a monolithic planar‑magnetic MEMS micro‑speaker that merges semiconductor‑grade precision with acoustic performance traditionally reserved for larger dynamic drivers. By fabricating the diaphragm, planar voice coil, and micro‑magnet in a single silicon‑based process, the speaker achieves ultra‑compact dimensions while maintaining a uniform diaphragm motion that yields low distortion and fast transient response. A proprietary high‑elasticity membrane preserves low‑frequency response despite the reduced moving mass, enabling a wide frequency band (≈200 Hz – 5 kHz) suited for speech and music. The design operates with minimal drive power, making it ideal for battery‑constrained wearables. Otowahr’s solution thus removes the size‑performance bottleneck, allowing OEMs to create smaller, lighter TWS earbuds and hearing‑aid form factors without compromising audio fidelity.

Target Audience

Primary customers are OEMs and contract manufacturers of true wireless stereo earbuds and hearing‑aid devices that require an ultra‑small, high‑fidelity speaker solution. The technology also serves audio module integrators targeting compact consumer electronics and medical hearing‑assistive products.

Features

  • Monolithic planar‑magnetic MEMS architecture integrating a micro‑assembled permanent ring magnet, deposited planar voice coil, and ultra‑light silicon diaphragm in a single semiconductor‑style process.
  • Proprietary high‑elasticity membrane material that enhances low‑frequency output while keeping the overall moving mass low.
  • Uniform diaphragm drive across the entire surface, delivering high accuracy, low harmonic distortion, and a wide, flat frequency response (200 Hz
  • 5 kHz).
  • Ultra‑compact footprint compatible with ITC, CIC, and IIC hearing‑aid packages as well as sub‑5 mm TWS earbud modules.
  • Low‑power operation without the need for auxiliary high‑voltage planar‑magnetic drivers, extending battery life in portable devices.
  • Semiconductor‑level dimensional precision and repeatability, enabling high‑volume, cost‑effective manufacturing and tight driver matching.
  • Standardized electrical interface compatible with existing audio ASICs and DSP pipelines for seamless OEM integration.
This profile is AI-generated and may contain inaccuracies.