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Helex

This company manufactures integrated circuits that combine compound semiconductors and silicon CMOS technology. Their chips are used in lighting systems, power electronics, and DC-to-DC converters, enabling improved performance and new functionalities in electronic applications.

City of New York, United StatesFounded 2021222K+ followers
Updated 3 months ago

Funding

Funding not disclosed

Funding rounds are not available yet.

Founders

Product

Problem

Silicon CMOS technology faces limitations in delivering the functionalities required for advancements in XR, visible photonics, and 5G/6G connectivity. Traditional methods of integrating compound semiconductors with silicon circuits involve advanced packaging techniques, leading to increased costs and yield issues.

Solution

nsc develops integrated circuits by monolithically integrating compound semiconductors with silicon CMOS, enabling new functionalities and improved performance in various applications. This heterogeneous integration brings together the advantages of both III-V materials and silicon on a single chip, overcoming the limitations of silicon-only solutions. By co-opting existing manufacturing equipment and processes, nsc delivers these integrated chips at commercial scale, avoiding the cost and yield challenges associated with advanced packaging. The resulting chips enable innovations in product, system, and software design across sectors such as augmented reality, virtual reality, smart lighting, telecommunications, and wearables.

Target Audience

The primary target audience includes companies in augmented reality, virtual reality, smart lighting, telecommunications, wearables, and automotive industries seeking advanced integrated circuit solutions.

Features

  • Monolithic integration of compound semiconductors and silicon CMOS.
  • PixelatedLightEngine™ for integrated lighting, offering increased pixel density, tailored light beams, and extended lifetimes.
  • PixelatedLightEngine™ for microdisplays, providing enhanced brightness, high resolution, and fast frame rates.
  • Digitally controlled power amplifiers for improved power, energy efficiency, and reduced footprint in wireless communication applications.
  • Phased arrays for focused wireless transmittance, addressing signal loss and power limitations in high-bandwidth communication.
  • Compatibility with existing manufacturing equipment and processes for scalable and cost-effective production.
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