Novolinc provides a nanocomposite thermal interface material that lowers thermal resistance to as little as 0.7 mm²·K/W, enabling more efficient heat transfer in high‑power electronic systems. The soft, compressible formulation offers low contact resistance without high compression pressure and can be applied and re‑worked at room temperature, with customizable composition and thickness for various OEM and contract‑manufacturing applications. Its durability through thousands of thermal cycles and scalable, IP‑protected manufacturing help manufacturers maximize performance and reliability of data‑center, AI, automotive, and consumer electronics.
Funding
Funding not disclosed
1OMVFounders
Product
Problem
High‑performance electronic chipsets generate large amounts of heat, and inadequate thermal management leads to reduced performance, lower reliability, and shortened device lifespans. Conventional thermal interface materials (TIMs) cannot keep up with the growing heat flux, creating a bottleneck in system cooling.
Solution
Novolinc offers a nanocomposite thermal interface material that dramatically lowers thermal resistance, achieving industry‑record values as low as 0.7 mm²·K/W. The material’s high thermal conductivity and low contact resistance enable efficient heat transfer between components without requiring high compression pressures. Its soft, compressible nature provides reliable, repeatable contact over many thermal cycles, and the formulation can be customized in composition and dimensions for specific applications. The TIM can be applied and re‑worked at room temperature, allowing easy assembly and maintenance of high‑power systems. By integrating this technology, manufacturers can extract maximum performance from their designs while maintaining long‑term reliability.
Target Audience
Primary customers are OEMs and contract manufacturers of high‑power electronics such as data‑center servers, AI accelerators, automotive power modules, and advanced consumer devices that require superior thermal management.
Features
- Nanocomposite formulation delivering thermal resistance as low as 0.7 mm²·K/W
- High intrinsic thermal conductivity combined with low interfacial contact resistance
- Soft, compressible material that conforms to surface irregularities without high pressure
- Room‑temperature, re‑workable bonding for easy assembly and serviceability
- Customizable material composition and thickness to suit diverse electronic packages
- Proven durability through thousands of thermal cycles with no performance degradation
- Scalable, IP‑protected manufacturing process suitable for volume production