Nova Spectral AI
Nova Spectral AI is developing affordable, lead-free SWIR image sensor chips using indium arsenide colloidal quantum dots deposited directly on standard silicon CMOS wafers. The technology enables drones, robots, and autonomous systems to see in darkness, smoke, haze, dust, and light fog. The company targets a field-ready sensor-array prototype by 2028 and a pilot fabrication line by 2029.
- Semiconductor
- New Materials
- Defense Tech
- Hardware
- Chemical Technology
Funding
Raised to date
₹21.2MRaised to date based on public sources. This may differ from the amount the company actually raised and is based only on what is publicly available on the internet.
Est. $253.8Kacross 1 round
AIEI₹21.2M · Seed
Announced Oct 2026
Disclosed cumulative: $253.8K
Founders
Founder details are not available yet.
Product
Problem
Drones, robots, and autonomous systems operating in real-world conditions face significant perception challenges. Conventional cameras fail in darkness, glare, smoke, haze, dust, and light fog, while existing shortwave infrared (SWIR) imaging solutions based on InGaAs sensors remain too expensive for widespread deployment beyond a few high-end systems.
Solution
Nova Spectral AI is building affordable, indigenous SWIR image sensor chips using lead-free indium arsenide (InAs) colloidal quantum dots (cQD) deposited directly on standard silicon CMOS readout wafers. The company is developing the full stack from quantum-dot ink chemistry and film deposition to charge transport layers and CMOS integration, aiming to bring reliable vision to every machine that needs it. The technology enables seeing at night by the faint natural glow of the night sky and seeing through smoke, haze, dust, and light fog. The company's roadmap targets a field-ready sensor-array prototype by 2028 and a pilot fabrication line with field pilots by 2029.
Target Audience
Primary customers are defense and intelligence, surveillance, and reconnaissance (ISR) partners, with the long-term market extending to smartphone, automotive, and electronics manufacturers seeking compact, affordable SWIR imaging for consumer and industrial devices.
Features
- InAs colloidal quantum dot (cQD) based SWIR sensors that are lead-free and monolithically integrated on standard silicon CMOS
- In-house formulated cQD inks and ligand exchange processes for stable, conductive photodiode stacks
- Film deposition technology for smooth, even quantum-dot coatings across wafers
- Charge transport layers designed to efficiently carry signals out of the quantum-dot film
- Full-stack integration capability from material synthesis to CMOS readout wafer patterning
- Development roadmap targeting field-ready prototype in 18 months and pilot fab by 2029