Neocera Magma provides MAGMA, a non‑invasive magnetic field imaging system that locates electrical faults deep inside advanced semiconductor packages without destroying the device. Using high‑Tc SQUID and GMR sensors, the platform detects ultra‑low current magnetic signatures through dense dielectric and metal layers, and its closed‑loop cryopump cooling eliminates the need for liquid nitrogen. This enables faster, precise fault isolation for failure‑analysis labs, packaging and SiP development teams, and R&D groups, reducing debug time and development costs.
Funding
Funding not disclosed
Founders
Product
Problem
Identifying electrical faults within advanced semiconductor packages often requires destructive testing or invasive probing, which can damage the device and prolong development cycles. Existing non-destructive methods lack the sensitivity to detect low-current magnetic signatures through dense multilayer structures, leading to ambiguous fault localization and delayed time‑to‑market.
Solution
Neocera Magma offers MAGMA, a non‑invasive magnetic field imaging system that locates electrical faults deep inside heterogeneous integration, system‑in‑package (SiP), and multi‑die substrates while keeping the chip fully functional. The platform combines high‑Tc SQUID and GMR sensors to capture extremely weak magnetic fields generated by low‑current flows, even through thick dielectric and metallization stacks. A closed‑loop cryopump cooling system eliminates the need for liquid nitrogen, simplifying operation and reducing footprint. By delivering precise, real‑time fault maps, MAGMA accelerates debug cycles, reduces resource waste, and shortens product development timelines for both research and production environments.
Target Audience
Primary customers are semiconductor failure analysis labs, advanced packaging and SiP development teams, and R&D groups that require precise, non‑destructive fault isolation for multi‑layer and multi‑die devices.
Features
- High‑Tc SQUID and GMR sensor array for ultra‑sensitive magnetic field detection of low‑current faults
- Capability to image through dense dielectric and metal layers in advanced chip packages
- Closed‑loop cryopump cooling that operates without liquid nitrogen, enhancing safety and ease of use
- Non‑destructive, non‑invasive measurement preserving full device functionality during analysis
- Rapid fault isolation workflow that shortens failure analysis and time‑to‑market
- Global shipping in custom ESD‑protected, climate‑controlled packaging