Nanotechna creates polymer‑based semiconductor chips doped with conductive nanoparticles that operate at petahertz frequencies, offering ultra‑high‑speed performance with up to ten percent lower power consumption than traditional silicon. The flexible, stretchable form factor can be attached to curved or moving surfaces, while nanoparticle pathways improve thermal conductivity for better heat management. Their EUV‑lithography manufacturing process uses less energy and recyclable materials, delivering a greener lifecycle for flexible electronics, wearables, aerospace, and high‑speed communication applications.
Funding
Funding not disclosed
Founders
Product
Problem
Conventional silicon chips are rigid, consume high power, generate significant heat, and have a substantial environmental impact during manufacturing and disposal. These limitations hinder the development of flexible, high‑frequency electronics needed for emerging applications such as wearables, aerospace, and advanced communication systems.
Solution
Nanotechna develops polymer‑based semiconductor chips doped with engineered nanoparticles that operate at petahertz frequencies. The flexible substrate allows the chips to be attached to curved or stretchable surfaces, expanding design possibilities for non‑planar devices. Integrated nanoparticle pathways improve thermal conductivity, enabling higher performance with lower operating temperatures. The manufacturing process reduces energy consumption and uses materials that are easier to recycle, resulting in a greener lifecycle. By leveraging EUV lithography on polymer films, Nanotechna delivers high‑density circuitry with significantly lower power draw compared to traditional silicon chips.
Target Audience
Primary customers are manufacturers of flexible electronics, wearable and implantable devices, aerospace and defense systems, and high‑speed communication hardware requiring lightweight, low‑power, and thermally efficient chips.
Features
- Polymer substrate doped with conductive nanoparticles for ultra‑high‑frequency (petahertz) operation
- Flexible and stretchable form factor that can be bonded to diverse surfaces, including curved and moving structures
- Enhanced thermal management through nanoparticle‑mediated heat conduction, supporting higher performance under load
- Low power consumption architecture, delivering up to ten percent less energy use than comparable silicon chips
- Environmentally friendly production with reduced energy requirements and fully recyclable materials
- EUV lithography adapted for polymer films, providing fine feature resolution and high circuit density