Skip to main content
N

NanoPrintek

NanoPrintek provides dry multimaterial printers that deposit solid functional powders directly, eliminating the need for inks, binders, solvents, and extensive post‑processing.

Auburn, UnitedFounded 20222300+ followers
Updated 1 month ago

Funding

Funding not disclosed

Funding rounds are not available yet.

Founders

Founder details are not available yet.

Product

Problem

Printed electronics and functional material manufacturing rely on ink-based processes that require binders, solvents, extensive post‑processing, and frequent machine cleaning, creating waste, supply‑chain fragility, and limited process control.

Solution

NanoPrintek offers dry multimaterial printers that deposit solid functional powders directly without inks, binders, or solvents, eliminating post‑processing steps and reducing material waste. The printers integrate the Smart Manufacturing Interface (SMI), which combines design file import (DXF, Gerber, STEP), machine‑vision alignment, real‑time process control, and automated logging. This unified software environment provides precise, repeatable deposition of electronics, sensors, and advanced functional materials while maintaining full traceability of each print job. By removing liquid chemistries, the system improves reliability, simplifies workflow, and supports a broader range of material combinations across multiple industries.

Target Audience

Primary customers are manufacturers and R&D teams developing printed electronics, sensor devices, and advanced functional materials who require precise, ink‑free deposition and streamlined process control.

Features

  • Dry, multimaterial deposition technology that prints solid powders without inks, binders, or solvents
  • Integrated Smart Manufacturing Interface (SMI) for design import, machine‑vision alignment, and process monitoring
  • Support for industry‑standard file formats (DXF, Gerber, STEP) enabling seamless workflow integration
  • Automated logging and traceability of print parameters for quality assurance and repeatability
  • Reduced post‑processing and cleaning requirements, lowering operational waste and downtime
  • Scalable to electronics, sensor arrays, and advanced functional material applications
This profile is AI-generated and may contain inaccuracies.