Nabu Optical Systems provides maskless optical lithography platforms that replace physical photomasks with a virtual‑mask direct‑write process, eliminating NRE mask costs and enabling rapid design changes. Their ANU‑1 system delivers 180 nm resolution on 4‑inch wafers at up to 10 wafers per hour, integrated with real‑time metrology and a unified software suite for low‑volume semiconductor prototyping and production.
Funding
Funding not disclosed
Founders
Product
Problem
Semiconductor developers face high non-recurring engineering (NRE) costs and long lead times associated with photomask production, which limits rapid prototyping and low‑to‑mid‑volume manufacturing for nodes between 180 nm and 500 nm. Traditional mask‑based lithography also restricts design flexibility and increases cycle time for research and small‑batch production.
Solution
Nabu Optical Systems delivers maskless optical lithography platforms that replace physical masks with a virtual‑mask, direct‑write approach. The flagship ANU‑1 system combines thermal projection lithography with high‑power pulsed lasers to achieve 180 nm resolution and a throughput of up to 10 4‑inch wafers per hour. Integrated metrology (Mithra) provides automated, high‑resolution imaging and real‑time defect mapping, while the ENKI laser suite offers tunable 1064 nm pulses (5–1000 ns) and pulse energies exceeding 10 mJ for versatile material processing. A unified software stack manages recipe definition, tool calibration, and data export, enabling rapid design iteration and reliable low‑volume production without the expense of mask fabrication. The solution is priced for university, government, and fab‑lab environments, with optional partnership services for process development and tool reconfiguration.
Target Audience
Primary customers are semiconductor research labs, university nanofabrication facilities, and low‑to‑mid‑volume foundries that require fast, flexible lithography for prototyping and small‑batch production at sub‑500 nm nodes.
Features
- Maskless direct‑write using a virtual mask, eliminating NRE mask costs and enabling on‑the‑fly pattern changes.
- Thermal projection lithography platform delivering 180 nm feature size with 10 wafer/hr throughput on 4‑inch wafers.
- ENKI high‑power fiber laser system: 1064 nm wavelength, pulse‑width 5–1000 ns, up to 10 mJ pulse energy, configurable with up to four laser modules and optional 532 nm frequency‑doubled output.
- Mithra automated metrology module featuring motorized objective lens swapping, high‑resolution cameras (250 nm imaging), and bend/warp measurement attachments for in‑process defect analysis.
- Real‑time metrology integration into the lithography workflow, providing closed‑loop feedback for pattern fidelity and yield optimization.
- Comprehensive software suite for recipe management, automated calibration, and secure data export compatible with standard semiconductor process control systems.
- Remote diagnostics and technical support through a strategic partnership model, including process design assistance and tool reconfiguration services.