Move2THz provides a CMOS‑compatible indium phosphide‑on‑silicon manufacturing platform that produces up to 300 mm InP wafers for high‑volume, low‑cost sub‑THz photonic and electronic components. The service includes standardized DFM libraries, design kits, and carbon‑efficient supply‑chain documentation, enabling semiconductor foundries and fabless designers to integrate InP devices with silicon electronics.
Funding
Funding not disclosed
Founders
Product
Problem
Current indium phosphide (InP) production is limited to small‑scale, high‑cost processes that are incompatible with mainstream CMOS wafer lines, resulting in scarce supply, high ecological impact, and restricted access for mass‑market sub‑terahertz (THz) applications. This bottleneck hampers the adoption of high‑frequency components in telecom, sensing, and emerging wireless systems.
Solution
Move2THz is creating a sustainable InP manufacturing platform that aligns with CMOS‑compatible wafer sizes through a breakthrough InP‑on‑silicon (InPoSi) process. By standardizing InPoSi integration, the project enables high‑volume, low‑cost production of InP wafers while substantially lowering the carbon footprint of the supply chain. The initiative establishes a European fab capable of delivering large‑diameter InP wafers ready for downstream device fabrication, thereby unlocking scalable sub‑THz components for commercial use. The platform also includes an ecosystem of design kits, process documentation, and material stewardship guidelines to accelerate adoption across the semiconductor industry.
Target Audience
Primary customers are semiconductor foundries, fabless device designers, and system integrators in telecom, automotive radar, and high‑frequency sensing markets seeking scalable sub‑THz InP components.
Features
- InP‑on‑silicon (InPoSi) bonding technology that supports wafer diameters up to 300 mm, matching standard CMOS fab equipment
- Process flow optimized for minimal InP material consumption, reducing rare‑metal usage and associated CO₂ emissions
- High‑throughput epitaxial growth and wafer‑scale metrology integrated into a dedicated European production line
- Standardized design‑for‑manufacturing (DFM) libraries and device models for sub‑THz photonic and electronic components
- End‑to‑end supply‑chain traceability with carbon‑efficiency metrics and circular‑economy guidelines
- Compatibility with existing CMOS process modules, enabling co‑integration of InP photonic devices with silicon electronics
- Open ecosystem support including technical documentation, reference designs, and collaborative access for industry partners