MotoVisio provides the MVue platform, a plug‑and‑play edge computing module built on the Qualcomm Snapdragon 8 Gen 2 processor that delivers high‑performance AI compute, multiple 4K camera interfaces, and extensive I/O in a compact, rugged form factor. The solution includes an out‑of‑the‑box software stack and engineering support, enabling robotics and IoT developers to accelerate time‑to‑market and lower development costs for autonomous aerial, underwater, industrial, medical, and transportation robots.
Funding
Funding not disclosed
Founders
Product
Problem
Developing AI‑enabled robotics and IoT devices often requires extensive hardware integration, low‑level software development, and specialized expertise, leading to long development cycles and high engineering costs.
Solution
MotoVisio offers the MVue platform, a plug‑and‑play edge computing module built around the Qualcomm Snapdragon 8 Gen 2 processor. The module combines high‑performance AI compute, multiple camera interfaces, and a comprehensive I/O suite in a compact form factor, allowing developers to focus on application logic rather than hardware bring‑up. An out‑of‑the‑box software stack provides drivers, middleware, and AI runtime support, accelerating time‑to‑market for autonomous aerial, underwater, industrial, medical, and transportation robots. By handling the low‑level integration and offering engineering support, MotoVisio reduces development costs and enables rapid prototyping of edge AI solutions.
Target Audience
Primary customers are robotics manufacturers, IoT device developers, and system integrators building autonomous vehicles or specialized robots that require on‑device AI processing.
Features
- Qualcomm QCS8550 (4 nm) platform with octa‑core Kryo CPU, Adreno 740 GPU, and dual eNPU delivering up to 48 TOPS INT8 and 12 TOPS FP16 AI performance
- 12 GB RAM and 128 GB flash storage for intensive workloads and data logging
- Triple CSI‑D‑PHY camera interfaces supporting 4K 240 fps decode and 8K 60 fps encode, plus AV1 decoding
- Extensive I/O: CAN bus, USB 3.1 Gen 2 Type‑C, PCIe Gen 3 (2‑lane), multiple high‑speed serial, SPI, I²C, and GPIOs via expansion headers
- Integrated software stack with drivers, middleware, and AI runtime to simplify sensor integration and model deployment
- Compact, rugged form factor designed for deployment in aerial, underwater, industrial, medical, and transportation robots
- Engineering support from a team with over 35 years of Qualcomm embedded systems experience