The startup develops micro-LED technology to create smart contact lenses with integrated displays that provide real-time information without the need for mobile devices. This solution enables users to access relevant data hands-free, enhancing connectivity and focus in various environments.
Funding
$247.5M raised to dateRaised to date based on public sources. This may differ from the amount the company actually raised and is based only on what is publicly available on the internet.
Founders
Product
Problem
Current display and optical interconnect technologies struggle to provide the combination of ultra‑compact size, high brightness, extreme bandwidth density, and low power consumption required for emerging AI‑enabled devices such as smart glasses and high‑performance data‑center links.
Solution
Mojo Vision offers a monolithic RGB micro‑LED platform that integrates sub‑micron blue micro‑LEDs with high‑efficiency quantum‑dot ink to produce vivid, stable colors in an ultra‑compact form factor. The panels are built on a 300 mm GaN‑on‑silicon process and wafer‑to‑wafer hybrid bonded to optimized CMOS backplanes, enabling seamless CMOS‑ready integration. This architecture delivers terabytes of data per millimeter of interconnect, dramatically reduces energy per bit, and provides thousands of parallel lanes for redundancy and reliability. The scalable manufacturing approach makes the technology suitable for high‑volume, cost‑effective production of next‑generation AI glasses and optical interconnect solutions.
Target Audience
Primary customers are OEMs and system integrators developing AI‑powered smart glasses, AR/VR headsets, and high‑performance optical interconnects for data‑center and high‑speed communication infrastructure.
Features
- Sub‑micron blue micro‑LED emitters combined with high‑performance quantum‑dot ink for bright, wide‑gamut RGB output
- Optimized CMOS backplane with wafer‑to‑wafer hybrid bonding for direct integration with any CMOS wafer
- Custom micro‑lens optics that enhance light extraction and focus for high‑density optical links
- 300 mm GaN‑on‑silicon process enabling high‑volume, cost‑effective manufacturing
- Ultra‑high bandwidth density delivering terabytes of data per millimeter of interconnect
- Ultra‑low power operation with significant reduction in energy per bit
- Extreme reliability through thousands of parallel lanes providing high redundancy