Mo-Link provides ultra‑compact active optical cable (AOC) and system‑in‑package (SiP) modules that deliver up to 200 Gbps within a sub‑2 mm form factor for board‑to‑board and chip‑to‑chip connections. Its portfolio includes fiber‑based HDMI 2.1, USB 3.2 Gen 2x2, DisplayPort 1.4, and magnetic‑hybrid connectors that are compatible with standard PCB footprints, helping data‑center, telecom, AV, and consumer‑electronics OEMs reduce layout complexity, assembly time, and cost.
Funding
Funding not disclosed
Founders
Product
Problem
Manufacturers of data‑center, AV, and consumer electronics face escalating bandwidth demands while needing to keep connector size, cost, and signal integrity within tight tolerances. Traditional copper or bulky optical interconnects often require complex PCB layouts, increase assembly time, and limit scalability for high‑speed applications. Additionally, integrating multiple functions into a single package without sacrificing reliability remains a design bottleneck.
Solution
Mo-Link delivers a portfolio of high‑bandwidth optical connection solutions built on advanced system‑in‑package (SiP) and active optical cable (AOC) technologies. By leveraging proprietary IC packaging, precision optical design, and material‑science expertise, the company produces ultra‑compact modules that transmit up to 200 Gbps within a sub‑2 mm form factor. Its product line includes fiber‑based HDMI 2.1, USB 3.2 Gen 2x2, and DisplayPort 1.4 modules, as well as magnetic‑hybrid and ultra‑high‑speed hybrid connectors for board‑to‑board and chip‑to‑chip links. All components are manufactured in‑house using pollution‑free workshops and automated intelligent production lines, ensuring high volume output with consistent quality and low unit cost. The solutions are compatible with standard PCB footprints and support seamless integration into existing design flows, reducing time‑to‑market for OEMs. Mo-Link also offers a SiP platform that consolidates multiple ICs and passive elements, simplifying system architecture and improving yield. Cloud‑enabled design tools and FHIR‑compatible APIs facilitate rapid prototyping and data exchange across the product lifecycle.
Target Audience
Primary customers are OEMs and system integrators in data‑center, telecommunications, AV, and consumer electronics sectors that require high‑speed, low‑profile optical interconnects and SiP solutions for board‑level and chip‑level integration.
Features
- Ultra‑compact OE module (200 Gbps) occupying only 10.55 mm × 7.5 mm × 1.95 mm, enabling high‑density routing in constrained enclosures.
- Magnetic hybrid connector with extended lifetime for typical optical interfaces, reducing wear and maintenance.
- Ultra‑high‑speed hybrid connector supporting split‑TV and multi‑stream video distribution with minimal insertion loss.
- SiP modules that integrate multiple ICs and passive components, delivering board‑space savings and faster QA cycles.
- Fiber‑based HDMI 2.1/2.0, USB 3.2 Gen 2x2, and DP 1.4 AOC modules with full‑fiber transmission for low latency and EMI immunity.
- In‑house precision optical alignment, material development, and advanced IC packaging processes ensuring sub‑dB loss and high reliability.
- Intelligent manufacturing platform with automated inspection, real‑time yield analytics, and pollution‑free workshop standards.
- Compatibility with standard PCB footprints and support for API‑driven integration into design automation tools.