MiWendo has developed a low-cost electromagnetic accessory that attaches to conventional colonoscopes, enhancing polyp detection by automating alerts and providing a 360-degree field of view. This technology addresses the issue of missed polyps during colonoscopies, which occurs in 22% of cases, thereby improving early detection rates of colorectal cancer.
Funding
$1.6M raised to dateRaised to date based on public sources. This may differ from the amount the company actually raised and is based only on what is publicly available on the internet.
Founders
Product
Problem
Colorectal cancer is highly curable if precancerous polyps are detected and removed during colonoscopies; however, a significant percentage of polyps are missed during the procedure, leading to delayed diagnosis and treatment. Conventional colonoscopies have a miss rate of 22% for polyps, which can impact early detection rates of colorectal cancer.
Solution
MiWEndo Solutions offers a low-cost electromagnetic accessory that attaches to standard colonoscopes to enhance polyp detection. The device uses microwave imaging to automate polyp detection by emitting an alarm when a polyp is sensed. It also increases the field of view to 360º and differentiates between malignant and benign tissues without disrupting current clinical practice. This technology integrates seamlessly into existing endoscopes, providing clinicians with improved visualization and detection capabilities.
Target Audience
The primary target audience includes gastroenterologists, hospitals, and clinics performing colonoscopies, particularly those focused on improving early detection rates for colorectal cancer.
Features
- Electromagnetic accessory compatible with conventional colonoscopes
- Automated polyp detection with real-time alerts
- 360-degree field of view for enhanced visualization
- Microwave imaging technology to differentiate between malignant and benign tissues
- Seamless integration into existing endoscopic workflows
- No ionizing radiation, ensuring patient safety
- Multi Jet Fusion TPU housing inner head