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MicroAlign

MicroAlign produces actively aligned fiber arrays that position each fiber core with sub‑micron pitch accuracy, delivering coupling losses below 0.1 dB to nanolithography‑defined waveguide ports. The modular 12‑ to 24‑channel arrays are compatible with standard SMF‑28 and specialty small‑core fibers, enabling high‑density, ultra‑low‑loss interconnects for photonic chips and quantum computing hardware. The automated alignment process ensures repeatable performance across large production volumes.

Updated 2 months ago

Funding

Funding not disclosed

Funding rounds are not available yet.

Founders

Founder details are not available yet.

Product

Problem

Coupling efficiency between optical fiber arrays and photonic integrated chips is limited by core positioning errors in conventional passive V‑groove assemblies. Misalignments introduce coupling losses of several tenths of a decibel, which is unacceptable for high‑density quantum and integrated photonic systems that require ultra‑low loss interconnects.

Solution

MicroAlign manufactures fiber arrays in which each fiber core is actively aligned during production, delivering the highest pitch accuracy available on the market. This active‑alignment process reduces the fiber‑to‑chip coupling loss to below 0.1 dB, preserving virtually all optical power. The arrays are compatible with standard SMF‑28 fibers as well as small‑core specialty fibers, and they match nanolithography‑defined waveguide ports on photonic chips. By providing a scalable, multi‑channel solution (e.g., 12‑ to 24‑channel arrays), MicroAlign enables dense fiber‑to‑chip interconnects without sacrificing performance. The resulting high‑efficiency connectivity supports demanding applications such as quantum photonic computing and advanced integrated photonic modules.

Target Audience

Primary customers are photonic chip manufacturers, quantum computing hardware providers, and integrated‑photonic foundries that require ultra‑low‑loss, high‑density fiber‑to‑chip interconnects.

Features

  • Active alignment of each fiber core with sub‑micron pitch accuracy, eliminating passive V‑groove tolerances
  • Measured coupling loss < 0.1 dB for both SMF‑28 and small‑core fibers across multiple channels
  • Modular array formats ranging from 12 to 24 channels, customizable for specific chip port layouts
  • Compatibility with nanolithography‑defined waveguide ports, ensuring seamless integration with photonic chips
  • High repeatability and low variance across production batches due to automated alignment technology
  • Option for bespoke fiber types and connector formats to meet specialized system requirements
  • Robust mechanical housing designed for reliable assembly in high‑volume photonic packaging processes
This profile is AI-generated and may contain inaccuracies.