Micledi designs and manufactures microLED display modules for augmented reality headsets, delivering ultra‑high resolution (over 9 kPPI), extreme brightness up to 10 Mnit, and low power consumption under 1 W in a lightweight form factor. Their high‑volume, low‑cost silicon‑based production process enables affordable, mass‑market AR devices with superior image quality and efficiency.
Funding
$25M raised to dateRaised to date based on public sources. This may differ from the amount the company actually raised and is based only on what is publicly available on the internet.
Founders
Product
Problem
Current augmented reality (AR) headsets struggle to combine high resolution, extreme brightness, low power consumption, superior image quality, and affordable cost in a compact form factor, limiting widespread consumer adoption.
Solution
Micledi develops microLED display modules that meet the demanding performance requirements of AR applications while enabling high‑volume, low‑cost manufacturing. By reconstituting epitaxial LED material onto 300 mm silicon carriers and hybrid‑bonding to CMOS backplanes, Micledi achieves sub‑3 µm pixel pitches, >9 kPPI resolution, and brightness up to 10 Mnit with power draw under 1 W for full‑HD operation. Integrated pixel‑by‑pixel micro‑lenses and advanced backplane control deliver high contrast, low de Mura, and stable lifetime. The resulting modules are lightweight, power‑efficient, and priced for mass‑market AR devices.
Target Audience
Primary customers are AR headset manufacturers and OEMs developing consumer, industrial, or personal‑computing AR devices that require high‑performance, lightweight microdisplays at scale.
Features
- Sub‑3 µm sub‑pixel pitch delivering >9 kPPI (future >14 kPPI) for FHD, 4K, and 8K resolutions
- Peak brightness up to 10 Mnit (≥1 Mnit at D65 white point) with quantum‑dot options
- Power consumption below 1 W (≈0.5 W at FHD, <0.2 W at half‑HD) enabling long battery life
- Pixel‑by‑pixel micro‑lens array and +/- 20° apex angle for high optical efficiency and wide field‑of‑view
- Integrated backplane control providing low de Mura, stable gamma, and excellent contrast with optical isolation
- 300 mm wafer reconstitution and hybrid bonding process yielding near‑100 % die‑attach yield and reduced material waste
- CMOS‑compatible, low‑defect red, green, and blue GaN arrays supporting monochrome, RGB stacking, and quantum‑dot color conversion