Funding
Funding not disclosed
Founders
Product
Problem
Current quantum memory solutions require cryogenic cooling, leading to high infrastructure costs, large footprints, and complex maintenance, which limits their adoption in telecom, cloud, and defense systems.
Solution
Memorionquantum offers room‑temperature quantum memory chips that operate without cryogenic equipment, reducing infrastructure expenses by up to 90%. The chips are fabricated using a 300 µm CMOS‑compatible process, allowing mass production on standard semiconductor foundries. Their modular design plugs directly into existing hardware platforms, eliminating the need for custom redesigns or architectural changes. This approach enables organizations to add quantum memory capabilities to current systems quickly and cost‑effectively, supporting scalable deployment across telecom, cloud, and defense applications.
Target Audience
Primary customers are telecom operators, cloud service providers, and defense contractors seeking to incorporate quantum memory into their existing infrastructure.
Features
- Room‑temperature operation removes the need for cryogenic cooling systems
- 300 µm CMOS‑compatible fabrication enables high‑volume, low‑cost manufacturing
- Plug‑in memory modules integrate with existing hardware without redesign
- Scalable supply chain with predictable unit economics for commercial deployment
- Compatible with telecom, cloud computing, and defense system architectures