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MAKR develops nanoscale 3D subsurface metrology tools that combine Acoustic Atomic Force Microscopy, optical tomography, and advanced data analytics. Its technology enables chipmakers to measure features at Angstrom resolution beneath opaque semiconductor layers. The solutions address critical metrology gaps for next‑generation semiconductor manufacturing.
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- MAKR develops nanoscale 3D subsurface metrology tools that combine Acoustic Atomic Force Microscopy, optical tomography, and advanced data analytics. Its technology enables chipmakers to measure features at Angstrom resolution beneath opaque semiconductor layers. The solutions address critical metrology gaps for next‑generation semiconductor manufacturing.