Loomia develops the Loomia Electronic Layer, a flexible, mesh-based circuit system designed for integration into textiles and soft goods, providing functionalities such as heating, pressure sensing, and data transmission. This technology addresses the need for reliable, scalable, and environmentally sustainable electronic solutions in industries like automotive, medical, and robotics.
Funding
$2M raised to dateRaised to date based on public sources. This may differ from the amount the company actually raised and is based only on what is publicly available on the internet.
Founders
Product
Problem
Traditional electronic solutions often lack the flexibility and seamless integration required for applications involving textiles and soft goods. Existing options like flex PCBs and printed inks on TPU can be rigid, have inconsistent conductivity, and may not be environmentally sustainable.
Solution
Loomia has developed the Loomia Electronic Layer (LEL), a flexible, mesh-based circuit system designed for integration into textiles and soft goods. The LEL offers functionalities such as heating, pressure sensing, and data transmission, providing a versatile alternative to traditional flexible circuits. Its thin, drapable design allows for seamless integration into various materials without the need for plastic housings. Silver-free conductor options are available for improved sustainability, and the production process avoids heavy chemical etchants.
Target Audience
The primary customers are engineers and product developers in the automotive, medical/wellness, and robotics industries seeking flexible and integrated electronic solutions for their products.
Features
- Mesh-based design providing greater flexibility and up to 50% stretch in serpentine configurations
- Consistent conductivity, offering a 40% improvement over printed inks on TPU
- Silver-free conductor options for enhanced environmental sustainability
- Scalable production in ISO 13485- and ISO 9001-certified facilities, with capacity up to 20,000 units per week
- HMI/Switch integration for touch-sensitive controls
- Flexible heating capabilities for uniform heat distribution
- Antenna and cabling functionalities for data transmission
- Pressure sensors/FSRs for detecting and measuring tactile forces