Liquid X supplies particle‑free, water‑based metallic inks that provide high conductivity, tunable viscosity, and strong adhesion for a variety of additive manufacturing processes such as inkjet, flexo, gravure, direct‑write, and screen printing. The company offers end‑to‑end support—including custom formulation, prototyping, substrate micro‑structuring, and in‑house performance testing—to help electronics manufacturers bring functional printed components like sensors, heating elements, and smart textiles from concept to commercial production.
Funding
$1.4M raised to dateRaised to date based on public sources. This may differ from the amount the company actually raised and is based only on what is publicly available on the internet.
Founders
Product
Problem
Manufacturers of electronic devices often lack cost‑effective, high‑performance conductive inks that can be integrated into existing additive manufacturing processes, limiting the ability to produce functional components such as sensors, heating elements, and smart textiles at scale.
Solution
Liquid X provides particle‑free, water‑based metallic inks that deliver high conductivity, excellent adhesion, and tunable viscosity for a range of printing methods, including inkjet, flexo, gravure, direct‑write, and screen printing. Their inks are formulated at the atomic level, reducing metal loading while achieving superior film properties compared with traditional nanoparticle inks. The company offers end‑to‑end support—from ink selection and formulation to prototype development, substrate micro‑structuring, and in‑house performance testing—enabling customers to move from concept to commercial production. By partnering with device manufacturers, Liquid X helps integrate functional printed electronics into products such as biosensors, resistive heaters, EMI shields, and energy‑harvesting components.
Target Audience
Primary customers are electronics manufacturers, printed‑electronics developers, and OEMs seeking functional conductive components for sensors, heating elements, smart textiles, and related devices.
Features
- Particle‑free metallic ink formulations (silver, gold, alloys) with reduced metal loading
- Water‑based, tunable viscosity inks compatible with multiple deposition techniques
- High electrical conductivity and excellent adhesion to diverse substrates
- Capability to produce highly reflective films and precise micro‑structured patterns
- In‑house prototyping, performance testing, and scale‑up support (R2R and S2S printing)
- Custom ink development tailored to specific application requirements
- Broad application portfolio including sensors, heating elements, smart textiles, RFID, and energy storage