Masataka Minamiyama
LINK-US Co.,Ltd.
LINK-US
LINK-US specializes in ultrasonic composite vibration bonding technology, which enables high-efficiency, low-damage metal joining without solder. This patented method addresses the challenges of traditional metal bonding in electric vehicle components and power devices, enhancing performance and reliability.
- Hardware
- Manufacturing / Industry 4.0
Updated 6 months ago
Funding
Raised to date
$10MRaised to date based on public sources. This may differ from the amount the company actually raised and is based only on what is publicly available on the internet.
Funding rounds are not available yet.
Founders
Product
Problem
Traditional metal bonding methods, such as soldering, can introduce defects and reduce the performance and reliability of electric vehicle components and power devices. These methods may also be inefficient and cause damage to the materials being joined.
Solution
LINK-US offers a patented ultrasonic composite vibration bonding technology that enables high-efficiency, low-damage metal joining without the need for solder. This method utilizes circular or elliptical vibrations to create strong and reliable bonds, addressing the limitations of conventional techniques. The technology is particularly well-suited for applications in electric vehicle components, lithium-ion batteries (LIBs), and power devices, contributing to the advancement of vehicle electrification and automation.
Target Audience
The primary target audience includes manufacturers of electric vehicle components, lithium-ion batteries, and power devices seeking improved metal bonding solutions.
Features
- Ultrasonic composite vibration technology for solderless metal joining
- High-efficiency and low-damage bonding process
- Circular or elliptical vibration method for creating strong bonds
- Ellinker 20k-HP: Ultrasonic composite vibration bonder
- Ellinker 20k: Ultrasonic composite vibration bonder
- Ellinker 40k: Ultrasonic composite vibration bonder
- Ellinker 40k× automatic stage: Ultrasonic composite vibration bonder with automatic stage (coming soon)