Lightium operates a production‑grade photonic foundry that fabricates 200 mm thin‑film lithium niobate (TFLN) wafers, offering a comprehensive process design kit across multiple wavelength bands for rapid prototyping to volume production. Its platform delivers high‑speed (>100 GHz) low‑voltage (≤1 V) modulation and strong nonlinear performance, reducing time‑to‑market and industrialization risk for photonic chip designers and system integrators.
Funding
$163.9K raised to dateRaised to date based on public sources. This may differ from the amount the company actually raised and is based only on what is publicly available on the internet.
Founders
Product
Problem
Designing and manufacturing photonic integrated circuits (PICs) on thin‑film lithium niobate (TFLN) requires specialized, high‑volume fabrication facilities that can deliver low‑voltage, high‑speed modulation and strong nonlinear performance. Existing foundries often lack the process maturity, wafer size, or design kits needed for production‑grade TFLN devices, leading to long development cycles and high risk for manufacturers.
Solution
Lightium operates a production‑grade photonic foundry that fabricates 200 mm TFLN wafers in a high‑volume environment, enabling rapid prototyping through to volume production. The company provides a comprehensive process design kit (PDK) covering multiple wavelength bands (C‑band, O‑band, 780 nm, 830 nm) and supports the intrinsic advantages of TFLN, such as >100 GHz light‑speed modulation, sub‑1 V drive voltage, a broad transparency window (350 nm–5.5 µm), and strong second‑ and third‑order nonlinearities. By offering a closed‑beta access model, Lightium reduces time‑to‑market and industrialization risk for customers developing next‑generation photonic solutions.
Target Audience
Primary customers are photonic chip designers, semiconductor manufacturers, and system integrators developing high‑speed, low‑power, or nonlinear optical components for data‑center, telecom, and emerging quantum or sensing markets.
Features
- 200 mm wafer fabrication in a high‑volume, production‑ready foundry
- Comprehensive TFLN PDK with four bandwidth options (C‑band, O‑band, 780 nm, 830 nm)
- Device performance supporting >100 GHz modulation and Vπ ≤ 1 V operation
- Wide optical transparency from 350 nm to 5.5 µm for diverse photonic applications
- High second‑ and third‑order nonlinear coefficients enabling efficient frequency conversion and parametric processes
- End‑to‑end service from rapid prototyping to volume production, including AI‑driven testing and advanced packaging collaborations