Designing and manufacturing photonic integrated circuits (PICs) on thin‑film lithium niobate (TFLN) requires specialized, high‑volume fabrication facilities that can deliver low‑voltage, high‑speed modulation and strong nonlinear performance. Existing foundries often lack the process maturity, wafer size, or design kits needed for production‑grade TFLN devices, leading to long development cycles and high risk for manufacturers.

Lightium operates a production‑grade photonic foundry that fabricates 200 mm TFLN wafers in a high‑volume environment, enabling rapid prototyping through to volume production. The company provides a comprehensive process design kit (PDK) covering multiple wavelength bands (C‑band, O‑band, 780 nm, 830 nm) and supports the intrinsic advantages of TFLN, such as >100 GHz light‑speed modulation, sub‑1 V drive voltage, a broad transparency window (350 nm–5.5 µm), and strong second‑ and third‑order nonlinearities. By offering a closed‑beta access model, Lightium reduces time‑to‑market and industrialization risk for customers developing next‑generation photonic solutions.

200 mm wafer fabrication in a high‑volume, production‑ready foundry

Comprehensive TFLN PDK with four bandwidth options (C‑band, O‑band, 780 nm, 830 nm)

Device performance supporting >100 GHz modulation and Vπ ≤ 1 V operation

Wide optical transparency from 350 nm to 5.5 µm for diverse photonic applications

High second‑ and third‑order nonlinear coefficients enabling efficient frequency conversion and parametric processes

End‑to‑end service from rapid prototyping to volume production, including AI‑driven testing and advanced packaging collaborations

Primary customers are photonic chip designers, semiconductor manufacturers, and system integrators developing high‑speed, low‑power, or nonlinear optical components for data‑center, telecom, and emerging quantum or sensing markets.