LightSpring provides a 3D-fabricated optical interconnection platform that routes light between photonic components, chips, and fibers beyond the constraints of traditional planar assembly. The platform writes connections directly in a single process step with sub-0.1 micron tolerance and automatic alignment, replacing days of manual alignment. It is designed to scale across foundry recipes, materials, and use cases, from single prototypes to full assembly lines.
Funding
€3.5M raised to dateRaised to date based on public sources. This may differ from the amount the company actually raised and is based only on what is publicly available on the internet.
IPAFounders
Product
Problem
Photonic systems are constrained by planar, two-dimensional packaging and manual alignment processes that are slow, imprecise, and difficult to scale. These limitations create bottlenecks in manufacturing and prevent the adoption of complex, high-performance optical architectures in industry-ready systems.
Solution
LightSpring provides a 3D-fabricated optical interconnection platform that routes light in three dimensions, connecting photonic components, chips, fibers, and light sources beyond classical assembly constraints. The platform writes each connection directly in a single process step, with automatic alignment and sub-0.1 micron tolerance, eliminating the need for days of manual alignment. Every connection is designed, characterized, qualified, and diagnosed as one integrated solution, enabling layouts that adapt to component-specific material, geometrical, and optical properties. The process is built to work across foundry recipes, materials, and use cases, making it scalable from a single prototype to an entire assembly line.
Target Audience
Primary customers are photonic chip manufacturers, foundries, and system integrators in industries such as telecommunications, sensing, and data centers that need scalable, high-precision optical packaging and interconnection solutions.
Features
- Direct 3D writing of optical interconnects in a single process step, replacing multi-day manual alignment workflows
- Automatic alignment and sub-0.1 micron tolerance for high-precision, reproducible connections
- Design flexibility that adapts to each component's material, geometrical, and optical properties, unconstrained by legacy footprints
- Process compatibility across foundry recipes, materials, and use cases for scalable deployment
- Integrated design, characterization, qualification, and diagnostics for each connection as a unified solution