Alexander Igelmann
CEO
Lidrotec
Lidrotec utilizes ultra-short pulse laser technology to achieve high-precision micro-manufacturing and material modification across various substrates. This technology enhances accuracy and efficiency in industrial applications, meeting the demand for improved processing capabilities.
- Hardware
- Manufacturing / Industry 4.0
- Semiconductor
Updated 23 months ago
Funding
Raised to date
$5.3MRaised to date based on public sources. This may differ from the amount the company actually raised and is based only on what is publicly available on the internet.
Funding rounds are not available yet.
Founders
Alexander Kanitz
Chief Innovation Officer
Product
Problem
Traditional wafer dicing methods can introduce heat and debris, leading to microcracks, surface contamination, and reduced chip yield, especially with advanced materials like SiC. Complex production steps such as step-cuts are often required to process different materials, adding to manufacturing complexity and cost.
Solution
Lidrotec offers a laser dicing technology, LidroCUT®, that utilizes ultra-short pulse lasers and controlled fluids to achieve high-precision micro-manufacturing and material modification across various substrates. The controlled fluids efficiently cool the workpiece surface, preventing heat input and microcracks, while also binding and rinsing away nano- and microparticles, ensuring a debris-free surface. This combination optimizes laser ablation through physicochemical interactions between the laser beam, liquid, and workpiece. The LidroDicer machine enables high-quality dicing for SiC and other materials, increasing production yield by producing burr-free and sharp cutting edges.
Target Audience
The primary target audience includes semiconductor manufacturers, energy companies, medical device manufacturers, electronics companies, and material science researchers seeking high-precision wafer dicing solutions.
Features
- Ultra-short pulse laser technology for high-precision cutting, structuring, grooving, and functionalization
- Liquid-assisted laser processing for efficient cooling, debris removal, and optimized ablation
- Burr-free and sharp cutting edges, leading to less scrap and increased production yield
- Minimal cutting widths and high aspect ratio, increasing the number of chips per wafer
- Freeform cutting capabilities, enabling innovative chip designs beyond conventional boundaries
- Material independency, eliminating the need for complex production steps like step-cuts
- Plug & play application with integrated SECS/GEM interface for seamless communication and streamlined operations
- Suitable for cleanroom environments