KXHITECH provides advanced semiconductor process materials, including IC trays, carrier tapes, and module trays, engineered to protect sensitive electronic components from environmental damage and ESD. Their solutions ensure the integrity and reliability of semiconductor packaging throughout the supply chain.
Funding
Funding not disclosed
Founders
Product
Problem
Semiconductor devices require robust protection against environmental factors such as physical impact, extreme temperatures, and electromagnetic interference during manufacturing and operation. Inadequate protection can lead to device degradation, performance issues, and premature failure.
Solution
KXHITECH provides advanced semiconductor process materials engineered to safeguard sensitive components. Their product portfolio includes specialized trays, carrier tapes, and module trays designed to shield semiconductor devices from external threats. By utilizing proprietary material science and precision manufacturing techniques, KXHITECH ensures the integrity and reliability of semiconductor packaging throughout the supply chain. The company's commitment to quality and innovation supports the demanding requirements of the semiconductor industry, enabling enhanced device performance and longevity.
Target Audience
Primary customers are semiconductor manufacturers and assembly houses that require specialized packaging and handling materials for their integrated circuits and electronic components.
Features
- **IC Trays:** Designed for semiconductor packaging and shipping, offering protection against electromagnetic interference (EMI), electrostatic discharge (ESD), physical impact, and high temperatures (up to 260°C). Available for a wide range of package types including TSOP, QFP, QFN, BGA, and SiP. Materials include ABS, PPE, PPO, PSU, PES, and PEEK, with surface resistivity options from 10E5 to 10E10 Ω/sq.
- **Carrier Tapes:** Used for automated component insertion onto PCBs, providing protection against physical forces and ESD during transport and storage. Applications include semiconductor components, LEDs, MLCCs, and other electronic parts. Available in various widths (8mm to 44mm) and thicknesses, made from materials like PS, PET, PC, and PC-ABS, with surface resistivity from 10E4 to 10E10 Ω/sq.
- **Module Trays:** High-performance vacuum-formed plastic products for protecting semiconductor and LCD modules, as well as precision electronic components, from impact and EMI. Suitable for DRAM, SSD modules, FPCB modules, and camera lens modules. Materials include mPS, PP, PET, and ABS, with surface resistivity options from 10E5 to 10E10 Ω/sq.
- **Wafer Ring Carriers:** Specialized boxes for secure storage and transport of wafers after sawing, designed to prevent damage from impact and triboelectric charges. Features improved transparency and cleanroom production (Class 100) with DI Water and ultrasonic cleaning. Available for 8-inch and 12-inch wafers, with surface resistivity options of 10E9 to 10E11 Ω/sq for coating and permanent static types.
- **SSD Cases:** Manufacturing of die-casting and press-type cases for Solid State Drives (SSDs), contributing to the trend in next-generation storage solutions.