Kuprion develops ActiveCopper™ sintering pastes and adhesives that provide tunable Coefficients of Thermal Expansion (CTEs) to match various substrates, enhancing thermal and electrical conductivity in high-power, high-temperature electronics. This technology mitigates thermal expansion stresses, improving the reliability and performance of devices in demanding applications such as electric vehicles and 5G telecommunications.
Funding
$5M raised to dateRaised to date based on public sources. This may differ from the amount the company actually raised and is based only on what is publicly available on the internet.
Founders
Product
Problem
High-power and high-temperature electronics face reliability issues due to thermal expansion mismatches between different materials within the device. These mismatches create stress, leading to fractures or cracks, especially in applications with extreme temperature fluctuations. Traditional lead-based solders, while offering some conductivity, pose environmental concerns and may not provide sufficient thermal and electrical performance for advanced applications.
Solution
Kuprion provides ActiveCopper™ sintering pastes, adhesives, inks, and gaskets engineered to deliver tunable Coefficients of Thermal Expansion (CTEs). These materials are designed to match the CTEs of various substrates, including ceramics, silicon, and silicon carbide, thereby mitigating thermal expansion stresses and enhancing device reliability. ActiveCopper™ serves as a lead-free alternative to traditional solders, promoting RoHS compliance while improving thermal and electrical conductivity. The materials are formulated to integrate into standard electronic manufacturing processes, enabling devices to operate reliably at higher power, voltages, frequencies, and temperatures.
Target Audience
The primary customers are manufacturers of high-power and high-temperature electronics across various industries, including automotive (electric vehicles), 5G telecommunications, semiconductor advanced packaging, cloud computing, aerospace, and defense.
Features
- Tunable CTEs to match various substrates, minimizing temperature-induced stresses
- High thermal and electrical conductivity for efficient heat transfer and performance
- Lead-free composition compliant with RoHS and REACH regulations
- Compatibility with standard electronic manufacturing processes
- Suitable for high-power, high-voltage, high-frequency, and high-temperature applications
- Ideal for micro-bumping and via fill in glass or organic interposers for heterogeneous integration
- Facilitates transition from silicon-based semiconductors to silicon carbide (SiC) or gallium nitride (GaN) based IGBTs