KOSES offers specialized semiconductor packaging equipment designed to improve precision and efficiency in back-end manufacturing processes. Their solutions include solder ball attach, marking, and substrate handling systems, enabling semiconductor manufacturers to enhance throughput and reliability.
Funding
Funding not disclosed
Founders
Product
Problem
The semiconductor manufacturing industry requires precise and efficient equipment for various packaging and assembly processes. Challenges arise in achieving high throughput and accuracy during critical steps like solder ball attachment, marking, and substrate handling.
Solution
KOSES provides specialized semiconductor packaging equipment designed to enhance precision and efficiency in manufacturing workflows. Their product line addresses key stages of semiconductor assembly, offering solutions that improve process reliability and output. By focusing on advanced machinery, KOSES enables semiconductor manufacturers to meet the demands of modern electronic component production.
Target Audience
The primary customers are semiconductor manufacturers and assembly houses that require specialized equipment for their back-end semiconductor processes.
Features
- Solder Ball Attach Systems: Equipment for precise placement of solder balls onto semiconductor substrates.
- Marking Systems: Solutions for laser and ink marking of semiconductor packages for identification and traceability.
- Laser Drilling Systems: Machinery for high-precision laser-based drilling of semiconductor materials.
- Package Stack Systems: Equipment designed for the efficient stacking of semiconductor packages.
- Package Laser Saw Systems: Tools for dicing and cutting semiconductor packages using laser technology.
- Flux Pre-Cleaning Systems: Systems for preparing semiconductor surfaces through flux application and cleaning.
- Substrate Merge & Sorting Systems: Automated equipment for merging and sorting semiconductor substrates.
- Loader & Offloader Systems: Automated material handling solutions for semiconductor manufacturing lines.
- Router Systems: Machinery for routing and shaping semiconductor substrates.
- Solder Ball Attach Tool Kits: Specialized tooling for solder ball attachment processes.
- Pick & Place Systems: Equipment for accurate placement of components during assembly.
- Laser Technology Applications: Expertise in laser marking, film cutting, patterning, OLED cell sealing, LLO, glass hole drilling, glass laser marking, wafer cutting, EMC decap, eWLB, and LED laser marking.