KelvinCooling provides a passive, hermetically sealed air‑cooling system that achieves heat‑transfer coefficients above 40 W/cm²·K for heat fluxes over 300 W/cm², outperforming traditional cold‑plate liquid coolers. By eliminating pumps and other active components, the solution offers maintenance‑free, stable thermal performance for data centers, HPC, edge computing, AI accelerators, and consumer devices such as PCs, laptops, and smartphones, while using a non‑toxic, eco‑friendly working fluid.
Funding
Funding not disclosed
Founders
Product
Problem
Data centers, high‑performance computing (HPC), edge devices, and AI accelerators generate high heat fluxes that exceed the capabilities of traditional air cooling, while liquid‑cooling solutions require active pumps, complex plumbing, and can be costly to maintain.
Solution
KelvinCooling offers a passive, hermetically sealed air‑cooling system that delivers a heat‑transfer coefficient (HTC) exceeding 40 W/cm²·K for heat fluxes over 300 W/cm², outperforming conventional cold‑plate liquid coolers. The technology relies on a specially engineered working fluid that provides high thermal conductivity without the need for electrical input or moving parts, ensuring stable performance and eliminating pump‑related failures. Because the unit is sealed and maintenance‑free, it reduces downtime and operational costs for data‑center, HPC, edge‑computing, and AI platforms. The solution is compatible with PCs, laptops, and smartphones, offering an eco‑friendly, non‑toxic, and non‑dielectric cooling option across a wide range of devices.
Target Audience
Primary customers are data‑center operators, HPC and AI system integrators, edge‑computing hardware manufacturers, and OEMs of high‑performance PCs, laptops, and mobile devices seeking high‑efficiency, low‑maintenance cooling solutions.
Features
- Passive cooling architecture with no active pumps or electrical components
- Heat‑transfer coefficient > 40 W/cm²·K at heat fluxes > 300 W/cm², surpassing typical cold‑plate performance
- Hermetically sealed design for zero maintenance and long‑term reliability
- Uses a non‑toxic, non‑dielectric working fluid optimized for high thermal conductivity
- Scalable form factors for servers, HPC racks, edge devices, AI accelerators, PCs, laptops, and smartphones
- Eco‑friendly construction with reduced energy consumption compared to active liquid cooling