Karman Industries provides the Heat Processing Unit (HPU), a modular, container‑sized thermal system that cools high‑density AI data center racks while capturing waste heat for reuse. 01, eliminates water consumption, and cuts mechanical footprint by up to 80%.
Funding
$7.5M raised to dateRaised to date based on public sources. This may differ from the amount the company actually raised and is based only on what is publicly available on the internet.
Founders
Product
Problem
Data centers, especially those powering AI workloads, convert nearly all electrical energy into heat, creating a cooling bottleneck that drives high energy consumption, large mechanical footprints, and water usage. As compute density grows, traditional chillers become inefficient, costly, and environmentally unsustainable.
Solution
Karman Industries offers the Heat Processing Unit (HPU), a modular, high‑density thermal system that cooles compute racks while capturing waste heat for reuse. The HPU integrates a CO₂‑based refrigerant cycle, an 800 V DC‑driven KOMPRESSOR, and advanced manufacturing techniques such as metal 3D‑printed turbomachinery and silicon‑carbide power electronics. By eliminating water‑based cooling and consolidating infrastructure into a single shipping‑container‑sized package, the HPU reduces Power Utilization Effectiveness (PUE) to as low as 1.01 and shrinks the mechanical yard by up to 80 %. Captured heat can be redirected to additional cooling, electricity generation, or district‑heating applications, turning a liability into a resource.
Target Audience
Primary customers are hyperscale data center operators, AI cloud providers, and large‑scale industrial facilities that require high‑density compute cooling and seek to improve energy efficiency and reduce environmental impact.
Features
- CO₂ natural refrigerant with GWP = 1, avoiding PFAS and meeting future regulatory standards
- High‑speed KOMPRESSOR with variable‑speed drive and non‑contact bearings for ultra‑low OPEX and minimal downtime
- 10 MW thermal capacity per unit, packaged in a single container for rapid site deployment
- 3D‑printed impellers and stator vanes delivering superior performance and compact form factor
- Zero water consumption, eliminating the need for traditional chillers and dry coolers
- Integrated heat‑reuse pathways for secondary cooling, power generation, or district heating
- Up to 80 % reduction in mechanical yard footprint and 90 % fewer components to install, commission, and maintain