JetCool provides a direct‑to‑chip microconvective liquid‑cooling platform that attaches precision cold plates to CPUs, GPUs and power electronics, eliminating the need for extensive plumbing in data centers and enterprise facilities. The plug‑and‑play system circulates coolant via modular distribution units and in‑rack manifolds, enabling higher compute density, lower power consumption and improved sustainability for AI, HPC, finance, semiconductor and EV inverter workloads.
Funding
$17M raised to dateRaised to date based on public sources. This may differ from the amount the company actually raised and is based only on what is publicly available on the internet.
2OBVFounders
Product
Problem
Conventional air‑based and traditional liquid cooling systems require extensive plumbing, large footprints, and significant facility modifications, limiting the ability to increase compute density and energy efficiency for high‑performance workloads.
Solution
JetCool delivers a direct‑to‑chip microconvective liquid cooling platform that removes the need for bulky infrastructure while providing high‑efficiency heat removal at the component level. The technology integrates liquid‑assisted air cooling and precision cold plates that attach directly to CPUs, GPUs, and power electronics, enabling higher power density and lower operating temperatures. Coolant Distribution Units (CDUs) and in‑rack manifolds circulate coolant without complex plumbing, allowing retrofits in existing data centers and enterprise facilities. The system supports a range of high‑performance applications—from AI and HPC to finance, semiconductor manufacturing, and electric‑vehicle inverters—by improving performance, reducing power consumption, and enhancing overall sustainability.
Target Audience
Primary customers include data center operators, enterprise HPC and AI clusters, high‑frequency trading firms, semiconductor manufacturers, and electric‑vehicle inverter designers seeking higher compute density and improved thermal management.
Features
- Direct‑to‑chip microconvective cooling that transfers heat from the die to a liquid medium with minimal thermal resistance
- Liquid‑assisted air cooling and modular cold plates optimized for Intel Xeon Sapphire Rapids, AMD EPYC Genoa, and NVIDIA H100 processors
- Plug‑and‑play Coolant Distribution Units (CDUs) and in‑rack manifolds that eliminate the need for extensive facility plumbing
- Quick‑disconnect fittings for fast installation, maintenance, and scalability across rack systems
- Scalable architecture that can be deployed in existing data centers and enterprise environments without major retrofits
- Energy‑efficient operation that reduces overall power draw and supports sustainability goals